3 天之前 · LDP 技术的原理是通过在电极之间蒸发锡，利用高压放电将其转化为等离子体，在电子与离子的碰撞过程中产生波长为 13.5nm 的 EUV 辐射，而这一波长恰好满足光刻市场的需求。

2024年7月1日 · 本文介绍了在没有EUV光刻机的情况下，如何通过浸润式光刻机和多重曝光技术来制造5nm芯片，涉及到了光刻工艺、晶体管密度、以及各种技术手段的应用。

EUV的波长是13.5nm，相比于193nmDUV提升了不止10倍，为未来很长一段时间的工艺微缩扫清了障碍。 首先我们简单科普一下光刻分辨率和工艺节点的关系， 为什么193mm的深紫外光刻机可以制造7nm工艺的芯片 ？

Extreme ultraviolet lithography (EUVL, also known simply as EUV) is a technology used in the semiconductor industry for manufacturing integrated circuits (ICs). It is a type of photolithography that uses 13.5 nm extreme ultraviolet (EUV) light from a laser-pulsed tin (Sn) plasma to create intricate patterns on semiconductor substrates.

2024年8月12日 · The results are line/space patterning of the HSQ resist down to HP 5 nm using the standard EUV wavelength 13.5 nm, and the compatibility of the tool with shorter wavelengths beyond EUV. Mirror-based interference lithography paves the way towards the ultimate photon-based resolution at EUV wavelengths and beyond.

A leading edge 5nm CMOS platform technology has been defined and optimized for mobile and HPC applications. This industry-leading 5nm technology features, for the first time, full-fledged EUV, and high mobility channel (HMC) finFETs with densest 0.021µm 2 HD SRAM.

1 天前 · Despite the potential, SMIC faces critical challenges that could impact the mass adoption of its 5nm technology: Lack of EUV Equipment: SMIC has been relying on DUV (Deep Ultraviolet) multi-patterning techniques due to U.S. export restrictions that prevent access to ASML’s EUV lithography equipment, making it difficult to achieve high yields ...

2025年3月8日 · However, commercializing an alternative EUV lithography tool will challenge ASML's position. ASML's latest High-NA EUV tool costs around 380 million US Dollars. No matter the cost for Chinese R&D centers, the Huawei EUV machine will deliver the much-needed upgrade path for the older DUV scanners, which previously limited domestic chip production.

4 天之前 · They achieved mass production of the 7nm (N+2) process without EUV and completed the development of the 5nm process to support the mass production of the Huawei Ascend 910C. The cost of SMIC’s ...

In 2020, TSMC led the foundry to start 5nm FinFET (N5) technology volume production to enable customers’ innovations in smartphone and high-performance computing (HPC) applications. TSMC N5 technology is the Company’s second available EUV process technology, following the success of its N7+ process.