2023年12月12日 · AIMS® systems have consistently demonstrated their value in the semiconductor industry for 30 years. Mask manufacturers rely on AIMS® for inspecting photomasks, to assess critical defects before they are used in wafer fabs. The latest generation AIMS® EUV can also inspect EUV masks.

ZEISS opens up a new era of actinic mask qualification with the new generation of AIMS ® EUV. Provides full emulation of the scanner imaging conditions for the NXE:3xy0 scanner systems, with extension capability to next generation EXE:5000 High-NA-EUV Scanner systems.

ZEISS celebrates 25 years of AIMS™ technology • Over the decades ZEISS has developed new AIMS™ generations to keep with the ongoing demands in mask making from i-line to EUV technology • More than 100 AIMS™ systems have been delivered to the industry during that time • AIMS™ has been established as an industry standard

For reviewing defects on EUV masks, ZEISS offers the next gene-ration of its AIMS® EUV. With its high precision stage for defect location accuracy and the employment of an EUV plasma Source, AIMS® EUV meets the industry production requirements for manufacturing defect-free EUV photomasks. Learn more: www.zeiss.com/mask-qualification

2024年11月13日 · To support EUV mask metrology applications for continuously scaling industry requirements, ZEISS developed a next generation EUV mask review tool, the AIMS® EUV 3.0. The new platform offers the industry a more cost-efficient solution with an improved productivity.

AIMS™ EUV program status: EMI program participants access to prototype running . Carl Zeiss SMT, Sascha Perlitz, Product Management . 05-Oct-15 5 . Current phase: Tool adjustment, calibrations . and initial qualifications . Next phase: Tool fine-tuning and stabilization to spec . Tool Launch EMI program participants

2023年11月22日 · We present the concept of AIMS® EUV high NA with focus on the emulation of a wafer defocus in the anamorphic high NA scanner. Besides defect review applications, this enables aerial image based high NA imaging studies.

Defect disposition by AIMS™ EUV and FAVOR ® meets requirements Core measurement capabilities

ZEISS and the SUNY POLY SEMATECH EUVL Mask Infrastructure consortium have developed and commercialized the EUV aerial image metrology system, the AIMS™ EUV. In this paper we present the latest achievements of this AIMS™ EUV platform together with data and analysis of LER/LWR measurements in the aerial image.

AIMS™ EUV targets NXE:3100 and NXE:33x0 aerial image emulation Performance Specifications