2024年5月17日 · TSMC says that it has managed to increase wafer-per-day-per-tool productivity of its EUV systems by two times since 2019. To do so, the company optimized the EUV exposure dose and the...

TSMC's N7+ Technology is First EUV Process Delivering Customer Products to Market in High Volume. The N7+ process with EUV technology is built on TSMC's successful 7nm node and paves the way for 6nm and more advanced technologies.

2024年9月10日 · TSMC's first ASML Twinscan EXE:5000, a High-NA lithography system designed specifically for R&D purposes, is set to be installed at TSMC's global research and development center in Hsinchu,...

2019年7月29日 · n5会广泛地使用euv技术，tsmc表示n5节点工艺的发展工艺与n7相似，并且目前已经达到了一个非常高水平的产量。 相较于n7节点，tsmc宣称n5将提供1.8倍的密度，同功耗15%的性能提升或者同性能30%的节能。同样地，n5也会像n7那样为移动端和hpc用途提供两种额 …

TSMC will bring N6 technology into risk production in the first quarter of 2020 for volume production by the end of the year. With further application of EUV, N6 will offer 18% higher logic density over N7, and design rules fully compatible with N7 enable customers to greatly shorten time-to-market. About TSMC

2019年9月3日 · 台积电的6nm 也是EUV，和目前N7设计兼容，可以无缝切换，但定位应该是成本敏感的市场，逻辑密度增加1.18X，明年1月份风险量产，实际到来至少也要明年下半年了。

2020年8月27日 · To further hit the message home, TSMC showcased a slide indicating where it stands in relation to others: by using a combination of public ASML statements and their own internal purchase sheets,...

2020年1月2日 · EUV tools installed at TSMC have reached production maturity, with tool availability reaching target goals for high-volume production, and output power of greater than 250 watts for day-to-day operations. Building on its successful experience, N7+ builds a solid foundation for TSMC’s 6nm (N6) and more advanced process technologies.

2020年7月9日 · TSMC developed the world’s first environmental-friendly Dry-Clean Technique for EUV Mask to analyze fall-on particles, and successfully reduced fall-on rate by 99%. TSMC adopted mask without pellicle for EUV process, reducing energy loss during exposure process.

2024年11月3日 · Nikkei Asia reports that TSMC is considering using its High NA EUV lithography machines to make processors that use angstrom 10 (A10) technology, about two generations ahead of the 2nm node...