Room-temperature bonding of vertical-cavity surface-emitting laser chips on Si substrates using Au microbumps in ambient air

Eiji HIGURASHI, Professor | Cited by 2,847 | of Tohoku University, Sendai (Tohokudai) | Read 320 publications | Contact Eiji HIGURASHI

In the flip-chip bonding process, eutectic AuSn (80-20 wt%) is commonly used for optoelectronic applications (melting temperature: 280°C) because the AuSn has very high yield strength and is...

Eiji SHAMOTO | Cited by 5,191 | of Nagoya University, Nagoya (Meidai) | Read 266 publications | Contact Eiji SHAMOTO

Eiji Fujiwara received the BS and MS degrees in electronic engineering in 1968 and 1970, respectively, and the DrEng degree in 1981, all from the Tokyo Institute of Technology, Tokyo, Japan. In 1970, he joined the NTT Electrical Communication Laboratories, and engaged in developing DIPS-1 and DIPS-11 computer systems and in research on fault ...

This research presents a novel approach to controlling chip flow in turning operations to prevent jamming, particularly for highly ductile materials. The proposed method employs guide grooves and a guide tunnel on the rake face of cutting tools to continuously guide chips toward a disposal or chip-pulling device, enhancing machining efficiency.

2024年10月11日 · 有限要素法解析技術を活用し，任意の工具形状に対して振動が生じた際に逃げ面に作用するプロセスダンピング力を，シミュレーション上で取り出す技術を開発した．有限要素法解析では，2次元切削に基づき材料の弾塑性変形挙動と熱・ひずみ速度依存性を考慮した所望の切削シミュレーションを実施した．解析において，不連続なテクスチャ形状がシミュレーションの不安定化を引き起こす問題が生じたが，これを回避する手法を確立し，テクスチャの …

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2021年3月22日 · 众所周知，Eiji剑魂装备打造一般，但技术超级给力，在“猴王”搭配下，征战各大副本！老版本的Eiji，逐渐闯出名声，真野猪竞速34S刷新记录。 然而，时代已经变了，正所谓技术不够装备来凑。Eiji对角色投入力度不大，剑魂装备打造一般，竞速早就无一席之地。

2013年9月20日 · An article in the Sankei News recalls the memory of those who knew Eiji Toyota as an engineer who showed his love for the manufacturing gemba – where the work was done. “There were always metal chips on the soles of his shoes,” from walking in the casting and machining plants. Eiji Toyoda led from the front. His message to leaders within ...