2022年12月15日 · The epoxy resins cured by cis-diamine-DBCOD possess controllable CTE from negative to positive due to the conformational switch of DBCOD units, and the CTE can be tuned by the DBCOD content. We demonstrate the DBCOD units can undergo conformational change from boat to chair conformer with the rise of temperature based on the theoretical ...

Selecting an adhesive with a low coefficient of thermal expansion (CTE) is one of the approaches to improve the bond strength and stability between dissimilar substrates. Low CTE adhesives mitigate the mismatch in thermal expansion between the substrates being bonded, as well as between the substrates and the adhesive.

2017年6月1日 · Efficiently cooling of electronic devices requires minimal coefficient of thermal expansion (CTE) mismatch of the heat source and heat sink. Nowadays, the heat source are usually Si-based 1.

2023年12月1日 · Epoxy resin (EP) is a highly promising material with great potential in packaging and adhesion. However, enhancing the toughness and reducing the coefficient of thermal expansion (CTE) of EP at a low filler content remains a challenge. To address this issue, we designed MXene nanofluids (MXene NFs) to modify epoxy resin.

2018年1月17日 · For the preparation of the ultra-low CTE epoxy composite, we designed new class of epoxy resin, i.e., the alkoxysilyl-functionalized epoxy resin (SiOEt-BPA). The new epoxy composite shows the extraordinary low-CTE, arising from the special contribution of alkoxysilyl substituent of the epoxy resin on the thermal property of the composite.

EB-315 is a low expansion, high temperature epoxy adhesive that is ideal for applications where thermal stability is critical. With a CTE of 25 in/in/°C at temperatures below 175°C, EB-315 maintains integrity at extremely high temperatures.

With their low CTE, rigid, highly filled epoxies thermal cycle similarly enough to the other materials in the electrical/electronic unit that insufficient stress develops to cause harm. However, often the encapsulant must provide more stress relief. In these instances, a more flexible encapsulant, even though it has a higher CTE, may be the ...

The coefficient of thermal expansion (CTE) was obtained for the epoxy resins with PCL-TCD-PU from the slope of the thermal expansion versus temperature curve below and above the glass...

2017年9月15日 · Thermal expansion behaviors of carbon fiber/epoxy plain woven composites were experimentally and numerically studied in this paper. The thermal strains and linear coefficient of thermal expansion (CTE) of plain woven composites were measured by a …

Coefficient of Thermal Expansion (CTE) is a measure of the expansion or contraction of a material as a result of changes in temperature. Most frequently it is provided as linear CTE but some times given as volumetric CTE.