The EVG520 IS is well suited for small-volume-production applications. Redesign based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS features EV Group's proprietary symmetric rapid heating and cooling chuck design.

2025年1月15日 · The EVG 520 is a wafer bonder capable of bonding pieces up to 150 mm wafers. It is primarily used for anodic, fusion and thermocompression bonding. Also the CL200 Megasonic Cleaner can be used before bonding to reduce particulate.

集evg最新技术及客户反馈基础上设计的evg520is，配备了evg公司的专利吸盘设计---这种吸盘可以提供对称的快速加热和冷却功能。 EVG520IS的很多优势特性，如独立的上下盘加热和高压键合工艺、高度的材料和工艺灵活性等，都帮助客户很好的实施键合研究和生产。

EVG500 シリーズはチャンバー内部の専用ツールを交換することで、個片化したダイや 50mm から300mm までのさまざまな形状・サイズのウェーハを接合することができます。 こうしたツールの交換によって、R&D から中規模生産までの用途に柔軟に対応します。 また、接合レシピは、量産向け装置であるEVG GEMINI シリーズと互換性があるため大量生産向けに容易に転用できます。 ボンドチャンバーにはユニバーサルボンドカバーが搭載されており、高速真空排 …

Redesigned based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS features EV Group's proprietary symmetric rapid heating and cooling chuck design.

The EVG520 IS is a single chamber unit which is capable of handling wafers up to 200 mm – offering semi-automated operation which is suited for small volume production. The EVG520 IS has been redesigned, taking into account customer feedback and updated with EV Group’s technological innovations.

EVG/EV GROUP 520是一種高端自動化模具結合系統，具有模具結合頭、晶片座、芯片輸送機、熱控單元、微觀視覺等組件；它具有精確的精度、可重復性、100%的置信度以及用於大批量生產環境的多元件和模具粘合能力。

产品简介：本机为我公司新一代背面减薄机，兼顾硬脆性材料，例如:蓝宝石、碳化硅、钨钢金属、陶瓷片，以及软脆性材料, 例如: 硅片、光学玻璃、石英晶、InP、GaAs、GaSb等及其他半导体材料的高精度切削减薄。 1. 高去除率 : 参考值:SiC 15um~20um/min, Si Wafer 40~50um/min （具体视砂轮的粒径、材质及工艺而定) 2. 行业领先的高精度减薄进度控制: min 0.1um/ 秒，特别适用于超薄易碎片减薄。 3. 日本进口变频器，日本进口 PLC 触摸屏，可实现多样化自主操作工艺 . …

Manufacturer: EVG Model: 520IS Qty x 2 units Type: Semi-Automated Wafer Bonding System Version: 100 mm and 150 Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding, Heater size = Max. wafer diameter: 150mm or 200mm, Bond chuck system, Max. contact force: 10kN, 20 kN, 60 kN,…

EVG / EV GROUP 520 is a state-of-the-art precision bonder offering high accuracy, reliability, and throughput to bond a wide range of substrates. It includes 8 bonding heads, ultra-flat field with 500x500mm working area, advanced and modern design, automated x, y, z-axis micron to nanometer positioning capabilities and adjustable bond temperature.