Redesign based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS features EV Group's proprietary symmetric rapid heating and cooling chuck design. Advantages such as excellent temperature and force uniformity, high-force-bonding capability, and the same material and process flexibility as on manual systems ...

Various wafer sizes and bond applications can be handled with a dedicated chuck that fits into each universal bond chamber. Leveraging highest-accuracy EVG SmartView NT technology, the top of the line GEMINI high-volume production system combines automated optical alignment and bonding operations at a minimum footprint area.

The EVG510 is a highly flexible wafer bonding system and supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct. The easy access bond chamber and tooling design allows for quick and easy retooling for different wafer sizes and processes.

Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production. The bond chamber is equipped with an universal bond cover that allows fast evacuation, rapid heating and cooling. Both anodic and pressure bonding processes are possible within one chamber.

Accommodating wafers and substrates up to 300mm, varying in size, shape and thickness, the EVG mask alignment system target MEMS, wafer bumping, chip scale packaging as well as all applications in compound semiconductors, power devices, LED and photovoltaic.

EVG's metrology system consists of top and bottom microscopes and a universal chuck. The X/Y alignment stage beneath the chuck allows for fast location of the alignment keys, eliminates extensive calibration efforts and allows processing of any substrate up to 300 mm.

In the EVG 510 chamber, the wafers are mounted on a mechanical fixture, the “bond chuck” that features 3 x 120 deg. spacer units (flags) and 2 clamps to maintain the stack of wafers together during the whole bonding process. The bond chuck is prepared either manually or in the EVG 610 bond aligner in the case where the two wafers need a ...

5" Bond Chuck / Hot Embossing Chuck for Square Substrates, PEEK-Coated (Item ID: LES-2320, EVG PN: CU5000954)

- 6-Inch/150mm Bond Chuck - Used on EVG 520 Wafer Bonder systems (with 8"heater). - Contact us for all your EVG tooling needs.

Our extensive parts inventory consists of new, refurbished and tested EVG parts available for fast delivery, most of which can be shipped same day. They come with a 30 day money back guarantee for peace of mind and are professionally packed & shipped to …