SoC Products Group has developed a CCGA to fine pitch ball grid array (FBGA) adapter socket to reduce RTAX-S/L development costs. SoC Products Group is also offering the CG624 package with the RTSX72SU, using the A54SX72A as the prototyping vehicle.

Products Group has developed a CCGA to fine pitch ball grid array (FBGA) adapter socket to reduce RT AX-S/L development costs. SoC Pr oducts Group is also offering the CG624 package with the

BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.

what a CCGA-FBGA adapter socket is, defines the com ponent parts, and describes how to assemble the

2016年12月1日 · BGA FBGA EMMC EMCP Socket Adapter, ALLSOCKET IC Testing Socket with 0.4mm,0.5mm,0.65mm,0.8mm,1.2mm or Irregular Pitch Custom-Made Specific Design Service(ALLSOCKET-BGA904-C-0.4)

The CQFP to FBGA adapter sockets have an FBGA configuration on the top and a CQFP configuration on the bottom. The adapter sockets enable customers to use a commercial Axcelerator FG package

Socket Body: PES, PEI, LCP or Equivalent Contact: Beryllium Copper Alloy Contact Plating: Gold or NiPd Contact Normal Force: 10~13 grams per pin Contact Current Rating: 0.5 amps Contact Resistance: 100 mW max Dielectric: 700V AC for 1 min. Insulation Resistance: 1,000 MW @ 500V DC Temperature Rating: 150°C Durability: 10,000 cycles

The FBGA is a surface mountable package with bottom ball termination of its external connections. The solder balls of all FBGA packages assure good solderability even after a long storage time. The land pattern design and SMT mounting of FBGA type packages are based on the IPC-7351 and IPC-7095 standards. A Non-Sol-

Ironwood Electronics has recently introduced a new high performance BGA socket for 0.8mm pitch, 1764 pin BGA IC’s. The SG-BGA-6503 socket is designed for IC size – 35x35mm package size and operates at bandwidths up to 27 GHz with less than 1dB of insertion loss. The contact resistance is typically 20 milliohms per pin.

There are two common types of socket: the more reliable type has spring pins that push up under the balls, although it does not allow using BGAs with the balls removed as the spring pins may be too short. The less reliable type is a ZIF socket, with spring pinchers that grab the balls. This does not work well, especially if the balls are small.