MEMS: Micro-Electro-Mechanical Systems. The genius of MEMS (Micro-Electro-Mechanical Systems) is at the heart of advanced wafer probe cards, accounting for ~75% of the world’s advanced probe card market. MEMS technology provides a way to manufacture the probes, which contact the I/Os and power connections on ICs at micron-level perfection.

FormFactor uses MEMS to build millions of tiny robust electrical springs capable of testing ICs over more than a million contact cycles. FormFactor offers a wide selection of engineering probes to meet the highly demanding requirements of on-wafer and signal integrity applications.

2017年6月14日 · 我们是市场上最大的探针卡供应商，占有34%的市场份额，是最近的竞争对手的两倍，是最大的mems探针卡供应商，约占市场份额四成，同样是最近的竞争对手的两倍。

FFI Hybrid MEMS Solution: Fine Pitch, High MAC, Low PI in One Head • Dualrobe design with composite, multi -p -material probe structure • Hybrid MEMS designs use different cross-s ection probes for different pitches • Independent optimization of power, ground, and I/O probes • Use finer pitch probe as needed for IO’s on

2017年10月1日 · This study—found that low-force vertical MEMS probe technology and advanced probe card construction design techniques can help to overcome the challenges, while improving production flexibility and uptime.

FFI MT Probe • MT next generation probes provide >50% improved CCC over current gen. MEMS probes • Higher speed performance with shorter probe length. • Hybrid compatible MT probe family to further enhance CCC and high-speed capability. • Metallized Guide Plate can further increase effective CCC to >3A 0

Development of 3D-MEMS Probe • Develop fine pitch cantilever with mechanical endurance • Achieve lower contact force with good contact resistance • Achieve precise xyz alignment in actual probe layout

• Apollo MEMS Probe Card Offers • Low probe force large probe count solution • Probe force <3gf, production proven >65K pin count design • Wide Range of Probe selection and offer hybrid probe head solution • Use large probe on power net with enhanced CCC feature • Use thin probe for signal net with high-speed feature

Source: Internal MP/FFI MEMS Shipment Data Implications • Increase in PCB complexity – design, validation, and fab – Simulation and validation tools/processes key to error reduction (leadtime/OTD) • Deploying PCB assembly+test technologies from other areas – Rapid advancement of standard SoC probecard PCB processes

2025年3月21日 · FormFactor uses MEMS to build millions of tiny robust electrical springs capable of testing ICs over more than a million contact cycles. FormFactor offers a wide selection of engineering probes to meet the highly demanding requirements of on …