
NLV32T-560J-EFD_TDK_NLV32T-560J-EFD中文资料_PDF手册_价 …
TDK NLV32T-560J-EFD参数名称:电感值:56uH;精度:±5%;额定电流:55mA;直流电阻 (DCR):8Ω;车规等级:AEC-Q200。 下载NLV32T-560J-EFD中文资料、引脚图、Datasheet数据手册,有功率电感详细引脚图及功能的应用电路图电压和使用方法及教程。
NLV25T-560J-EF_(TDK)NLV25T-560J-EF中文资料_价格_PDF手 …
立创商城提供(tdk)的(功率电感)nlv25t-560j-ef中文资料,pdf数据手册,引脚图,封装规格,价格行情和库存等信息,采购nlv25t-560j-ef上立创商城。 恭喜您获得
NLV32T-560J-EF : Detailed Information - TDK Product Center
You can check the latest information (Product status/Size/Electrical characteristics etc.) of NLV32T-560J-EF: SMD / SMT Inductors (Coils).
NLV25T-560J-PF TDK | Mouser - 贸泽
nlv25t-560j-pf tdk 射频电感器(smd型) suggested alternate nlv25t-560j-ef 数据表, 库存, 价格.
560J Hammond Manufacturing | Mouser - Mouser Electronics
560J Hammond Manufacturing Audio Transformers / Signal Transformers Broadcast quality, potted, for Collector to Line or Line to Base datasheet, inventory, & pricing.
560J Hammond Manufacturing | Transformers | DigiKey
Order today, ships today. 560J – 600, 150/150 Impedance Primary Ohms 4.8k, 1.2k/1.2k Impedance Secondary Ohms Audio Transformer 30Hz ~ 30kHz Through Hole from Hammond Manufacturing. Pricing and Availability on millions of electronic components from Digi …
FYF系列反应釜-武晋化机 - hgjx.cn
2023年1月17日 · fyf系列反应釜 本设备应用于医药、化工、食品、轻工、锂电等行业中的水解、中和、配制、合成、结晶、蒸馏、蒸发等生产过程。 反应釜可采用304、316L、钛材、合金钢等材料制造。
560j - 芯片丝印反查 - 芯片丝印反查网 - smdmark.com
使用说明: · tlv3201aidbvr 丝印是 rai,直接输入 rai ,即可筛选出原来的型号 tlv3201aidbvr。. · mmbd7000lt1g 丝印是 m5c3 ,其中丝印是 m5c ,而 3 是标示批号13年的意思。 以丝印搜索的时候应该搜索m5c,便会显示原来的型号是mmbd7000lt1g。同样,通过搜索型号mmbd7000lt1g,也可以显示出来丝印是m5c。
KITE VERSATILE FYF 500 HYBRID FIBREGLASS/CARBON
KITE VERSATILE FYF 500 HYBRID FIBREGLASS/CARBON. Designed for advanced kite flyers who are looking for a fibreglass/carbon, versatile kite, to progress their flying skills and freestyle tricks. Hybrid carbon/fibreglass structure for excellent balance durability/lightweight frame.
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560J - Hammond Mfg.
560J P.C. BOARD MOUNT - EPOXY POTTED AUDIO TRANSFORMER Rugged black epoxy potted case with 9 pin connections (0.25” square by 0.5” long) Higher signal levels possible with reduced low frequency performance Electrostatic shield between primary & secondary connected to core and pin “SH” Humbucking construction