2025年2月8日 · QFN（Quad Flat No-lead Package，方形扁平无引脚封装）是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。 由于底部中央大暴露的焊盘 …

Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and …

As one of the strategies for sustainable competitive advantages and to address the issue, UTAC introduced a new generation of leadframe package design called Grid Array QFN (GQFN), …

2014年11月11日 · semiconductor testing and assembly services provider, today announced that its new Grid Array Flat No-Lead (GQFN) package has received customer qualification and is …

UTAC offers the next generation in leadframe packaging: Grid Array Quad Flat No-Lead (GQFN). A revolutionary package that is capable of providing the highest I/O density of any lead frame …

2023年8月11日 · QFN stands for Quad Flat No-Lead, which is a type of surface mount package. BGA stands for Ball Grid Array, which is connected to the PCB through an array of solder balls …

JEDEC defines the QFN as a ‘no-lead semiconductor package with metalized terminals on four sides of the bottom surface of the package’. Although a single row of contacts located along …

UTAC offers the next generation in leadframe packaging: Grid Array Quad Flat No-Lead (GQFN). A revolutionary package that is capable of providing the highest I/O density of any lead frame …

dual-row QFN, several multi-row QFN options have achieved high volume success and UTAC’s latest option, the Grid-array QFN (GQFN), adds capability for single layer routing and highly …

A medium-gain Grid Array Antenna (GAA) is developed and manufactured in ESL41110, a low εr Low Temperature Co-fired Ceramics (LTCC) from ElectroScience Laboratory. The antenna …