Product Description: EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. Typical Properties: Cure …

HDK ® H21 is applied as a thickening and thixotropic agent in composites, coatings, adhesives and sealants, especially in vinylester, epoxy and polyurethane systems. HDK ® H21 is not …

HDK® H21 is a synthetic, hydrophobic, amorphous silica produced via flame hydrolysis. It is a white colloidal powder of high purity. HDK® H21 is used as a thickening and thixotropic agent …

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2020年7月1日 · HDK® H21 Pyrogenic Silica Synthetic, hydrophobic, amorphous silica, produced via flame hydrolysis. Properties White colloidal powder of high purity. HDK® H21 | Most recent …

2021年1月20日 · HDK® H21 is applied as a thickening and thixotropic agent in composites, coatings, adhesives and sealants, especially in vinylester, epoxy and polyurethane systems. …

A two component, silver filled, electrically conductive adhesive for high performance bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated …

H21钢，含钨热作模具钢，含有较多的易形成碳化物的铬、钨元素，因此在高温下有较高的强度和硬度，在650℃时硬度达HB～300，但其韧性和塑性较差。

This page is mainly introduced the H21 Datasheet, including chemical information,mechanical properties, physical properties, mechanical properties, heat treatment, and Micro structure, etc.

EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications.