High Bandwidth Memory - Wikipedia
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.
HBM火了，它到底是什么？ - 知乎专栏
HBM== High Bandwidth Memory 是一款新型的CPU/GPU 内存芯片（即 “RAM”），其实就是将很多个 DDR芯片 堆叠在一起后和GPU封装在一起，实现大容量，高位宽的DDR组合阵列。先看个平面图：
HBM4 memory to double speeds in 2026 - Tom's Hardware
2023年11月27日 · Today, TrendForce shed some light on the future of high bandwidth memory (HBM) technology and HBM4, specifically, which is expected to debut in 2026. This upcoming technology promises to extend...
全球首个第六代HBM！三星完成HBM4内存逻辑芯片设计：4nm工 …
2025年1月6日 · HBM（High Bandwidth Memory）即高带宽存储器，主要应用于高性能计算（HPC）、人工智能（AI）和图形处理（GPU）等领域。 HBM的优点在于打破了内存带宽及功耗瓶颈。 其核心优势在于采用了3D堆叠技术，将多个DRAM芯片垂直堆叠在一起，通过硅通孔（TSV）技术实现芯片间的高速信号传输，大大缩短了数据传输的距离和延迟，从而能够以极高的带宽为处理器提供数据支持。 HBM特性尤其适合搭配GPU进行密集数据的处理运算。 英伟达 …
What Is HBM4? - Supermicro
High bandwidth memory 4 (HBM4) is an advanced type of memory designed to deliver significantly higher data transfer speeds and performance compared to traditional DRAM technologies.
Preliminary HBM4 specs point to major performance uplift for …
2024年7月12日 · On Friday, the JEDEC Association published preliminary specifications for the 4th Generation high-bandwidth memory (HBM4) as it is getting closer to completing the HBM4 DRAM standard. As...
[News] JEDEC Releases New HBM4 Spec as Memory
2024年7月15日 · As top memory giants and AI chip companies all gear up for the combat of next-gen high bandwidth memory (HBM), JEDEC, the leader in the development of standards for the microelectronics industry, revealed the preliminary specifications of HBM4 last week.
HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit …
2023年10月12日 · Designed as a wide-but-slow memory technology that utilizes an ultra-wide interface running at a relatively modest clockspeed, HBM's current 1024-bit memory interface has been a defining ...
SK hynix Ships World's First 12-Layer HBM4 Samples
1 天前 · SK hynix aims to complete preparations for mass production of 12-layer HBM4 products within the second half of the year, strengthening its position in the next-generation AI memory market. The 12-layer HBM4 provided as samples this time feature the industry’s best capacity and speed which are essential for AI memory products.
SK hynix Ships World's First 12-Layer HBM4 Samples to Customers
1 天前 · Following its achievement as the industry's first provider to mass produce HBM3 in 2022, and 8- and 12-high HBM3E in 2024, SK hynix has been leading the AI memory market by developing and ...