High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.

HBM== High Bandwidth Memory 是一款新型的CPU/GPU 内存芯片（即 “RAM”），其实就是将很多个 DDR芯片 堆叠在一起后和GPU封装在一起，实现大容量，高位宽的DDR组合阵列。先看个平面图：

高頻寬記憶體（HBM,High Bandwidth Memory），是將DRAM透過先進封裝技術堆疊而成，與GPU整合於同一塊晶片上，更有利於就近存取、傳輸資料。 主要作法為利用矽穿孔（TSV）技術，在晶片鑽出小洞，再填充如銅這樣的導電物質，連接金屬球以達通電效果。 HBM技術難在哪？ 「把DRAM疊起來」聽來簡單，但實際上存在不少技術難度。 瓦伊迪亞納坦指出3項關係著良率的技術難點： 首先，是厚度。 HBM厚度僅能為人類頭髮的一半，意味著每一層DRAM的厚度都 …

HBM is a breakthrough memory solution for performance, power and form-factor constrained systems by delivering high bandwidth, Low effective power & Small form factor

High Bandwidth Memory (HBM) has been revolutionizing the way high-performance computing systems manage data flow. One of its most notable features is the considerable increase in bandwidth compared to traditional memory solutions. HBM achieves this through the use of stacked DRAM chips interconnected by through-silicon vias (TSVs) and microbumps.

高带宽内存（英语： High Bandwidth Memory ，缩写 HBM ），是三星电子、超微半导体和SK海力士发起的一种基于3D堆栈工艺的高性能DRAM，适用于高存储器带宽需求的应用场合，与高性能图形处理器、网络交换及转发装置（如路由器、交换器）、高性能数据中心的AI特殊 ...

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology.

hbm 为数据中心和人工智能领域带来生机。 在数据中心，凭高带宽、高容量特性，快速读写数据，提升处理效率；在人工智能领域，利用低延迟和高带宽优势，加速模型训练与推理，提升系统性能。

Samsung's HBM (High Bandwidth Memory) solutions have been optimized for high-performance computing (HPC), and offer the performance needed to power next-generation technologies, such as artificial intelligence (AI), that will transform how we live, work, and connect.

HBM, supplying the high-bandwidth and high-speed data solution in device, is supporting it behind the scenes. Compared to traditional DRAM, HBM structure is quite different with 3D-stacked at wafer process.