In just 15 months since launching HBM2E mass production, SK hynix solidified its leadership in high-speed DRAM by developing an HBM3, the latest in high-bandwidth memory for cutting-edge technologies across datacenters, supercomputers, and AI.

2022年9月8日 · SK海力士在业界率先开发出最新高带宽存储器（HBM, High Bandwidth Memory）产品HBM3，公司不仅又一次创造历史，更进一步巩固了SK海力士在DRAM市场上的领先地位。 SK海力士于2021年10月成功开发出HBM3，并于2022年6月开始量产。

2024年9月26日 · SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has begun mass production of the world’s first 12-layer HBM3E product with 36GB 1, the largest capacity of existing HBM 2 to date. 1 Previously, the maximum capacity of HBM3E was 24GB from eight vertically stacked 3GB DRAM chips.

2022年9月8日 · When HBM was developed as a memory solution optimized for high-level computing performance (HCP), it offered a new paradigm on solving the memory bottleneck as it aimed to increase capacity and bandwidth simultaneously. SK hynix jointly developed the world’s first TSV (Through Silicon Via) HBM product with AMD in 2014.

2024年9月26日 · SK海力士（或‘公司’， https://www.skhynix.com）26日宣布，公司全球率先开始量产12层HBM3E，实现了现有HBM 1 产品中最大 2 的36GB（千兆字节）容量。 1高带宽存 …

4 天之前 · SK hynix has begun shipping samples of its new groundbreaking AI memory solution, the 12-layer HBM4, to major customers ahead of schedule.

4 天之前 · SK hynix also adopted the Advanced MR-MUF process to achieve the capacity of 36GB, which is the highest among 12-layer HBM products.

2024年10月17日 · SK海力士 (SK Hynix)推出的路线图显示，该公司将继续主导人工智能 (AI)不可或缺的高带宽内存 (HBM)的生产 (见 图1)。 业内专家告诉笔者，该公司相对于竞争对手三星和美光的领先地位将面临更激烈的竞争。

2024年5月2日 · SK hynix currently controls roughly 46% - 49% of HBM market, and its share is not expected to drop significantly in 2025, according to market tracking firm TrendForce. By contrast, Micron's...

2024年3月19日 · 1HBM（High Bandwidth Memory）：垂直连接多个DRAM，与DRAM相比显著提升数据处理速度的高附加值、高性能产品。 HBM DRAM产品以HBM（第一代）、HBM2（第二代）、HBM2E（第三代）、HBM3（第四代）、HBM3E（第五代）的顺序开发。 HBM3E是HBM3的扩展（Extended）版本