2021年12月3日 · An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer ® can help you create a powerful HDI PCB design .

hdi pcb中使用的通孔类型 微孔（Micro vias）：微孔是连接PCB不同层的微小孔洞，通常直径小于150微米。 这种小尺寸允许更精确的连接，并节省了板上的空间。

2024年10月28日 · HDI叠孔是指在PCB设计中，两个或多个孔（通常是盲孔或埋孔）在垂直方向上重叠在一起的设计（如上图所示）。 这种设计方式可以最大限度地利用空间，提高布线密度，使得在有限的板面上能够布置更多的线路和元件。 然而，这种设计也带来了更高的制造难度和成本，因为需要精确控制孔的位置和深度，以确保它们在垂直方向上能够准确重叠。 与叠孔不同，HDI错孔设计是指在PCB设计中，两个或多个孔在垂直方向上错开排列，不重叠（如上图所示）。 这 …

2021年8月24日 · HDI PCBs, or microvia PCBs, feature blind microvias, fine traces, and sequential lamination manufacturing. This article introduces HDI PCB structure and manufacturing.

2024年11月4日 · Understanding HDI PCB Via Types: Microvias, Blind Vias, and Buried Vias. High-Density Interconnect (HDI) technology has revolutionized the printed circuit board (PCB) industry by enabling the design of more compact and efficient electronic devices. A critical aspect of HDI PCBs is the use of various via types, which facilitate electrical ...

High Density Interconnect (HDI) printed circuit boards (PCBs) are circuit boards with a higher wiring density per unit area than traditional PCBs. HDI PCBs have denser interconnections and components, finer lines and spaces, and higher connection pad density. They also have smaller vias and traces, and higher layer counts.

2025年3月13日 · One of the key innovations within HDI PCB design is the use of blind and buried vias, which enhance routing capabilities by freeing up additional routing resources, increasing the amount of routing channels while requiring fewer signal layers, and optimizing board space.

2019年1月14日 · Sequential build-up technology (HDI) has three major characteristics: Dielectric Format, Via Formation, and Metallization Methods (Courtesy of DuPont).

2018年5月25日 · Using skip vias eliminates buried vias from L2-L3, so it eliminates a drilling and plating step in the HDI stackup design; Using skip vias eliminates a reliability problem present in stacked blind-buried vias; not all manufacturers can guarantee

HDI PCBs have high-density attributes, including laser microvias, sequential lamination structures, fine lines, and high-performance thin materials. This increased density enables more functions per unit area.