High Bandwidth Memory 3 (HBM3) is a memory standard (JESD238) for 3D stacked synchronous dynamic random access memory (SDRAM) released by JEDEC in January 2022, offering significant improvements over the previous HBM2E standard (JESD235D).

In just 15 months since launching HBM2E mass production, SK hynix solidified its leadership in high-speed DRAM by developing an HBM3, the latest in high-bandwidth memory for cutting-edge technologies across datacenters, supercomputers, and AI.

HBM3 is the latest generation of High Bandwidth Memory (HBM), a high-performance 2.5D/3D memory architecture. Operating at 6.4 Gigabits per Second (Gb/s), HBM3 can deliver a bandwidth of 819 Gigabytes per Second (GB/s).

Micron HBM3E provides higher memory capacity that improves performance and reduces AI CPU offload for faster training and more responsive queries when inferencing LLMs such as ChatGPT.™. AI unlocks new possibilities for businesses, IT, engineering, science, medicine and …

Jul 26, 2023 · Today Micron announced its new HBM3 Gen2 memory is sampling to its customers, claiming it's the world's fastest with 1.2 TB/s of aggregate bandwidth and the highest-capacity 8-high stack at 24GB...

Apr 15, 2021 · HBM stands for high bandwidth memory and is a type of memory interface used in 3D-stacked DRAM (dynamic random access memory) in some AMD GPUs (aka graphics cards), as well as the server,...

Apr 16, 2022 · HBM3 memories will soon be found in HPC applications such as AI, Graphics, Networking and even potentially automotive. This article highlights some of the key features of the HBM3 standard such as high capacity, low power, improved channel and clocking architecture, and more advanced RAS options.

HBM3 Icebolt stacks 12 layers of 10nm-class 16 Gb DRAM dies for 24GB of memory - an astonishing 1.5 times more than our previous generation. The latest solution lets you go deep to build more robust neural networks and manage data faster than ever.

Jan 27, 2022 · HBM3 is an innovative approach to raising the data processing rate used in applications where higher bandwidth, lower power consumption and capacity per area are essential to a solution’s market success, including graphics processing and high-performance computing and servers.

Oct 9, 2021 · HBM3 is a 3D DRAM technology which can stack upto 16 DRAM dies, interconnected by Through-Silicon Vias (TSVs), and microbumps. Lets take a quick look at key differentiating features in HBM3.