HBM3 于 2022 年 1 月推出，是一种高性能 2.5D/3D 内存架构 ，HBM3的位宽还是 1024 bit，速率达到 6.4 Gb/s，能提供 819 GB/s 的带宽；而 HBM3E 速率达到了9.6 Gb/s，目前是最新一代的 HBM。

Micron’s 8-high 24GB HBM3E is shipping with NVIDIA H200 Tensor Core GPUs and production-capable 12-high 36GB HBM3E is also available. Dive into the rapidly evolving landscape of AI with Micron HBM3E, the industry’s most efficient high-bandwidth memory offering 30% lower power than the competition.

Micron HBM3E has an industry best data rate of >9.2 Gb/s and 24GB capacity in an 8-high cube, resulting in >1.2 TB/s bandwidth with 2.5X performance/watt compared to the previous generation HBM2E. All this is made possible with the most advanced 1β process node from Micron along with innovations in CMOS and packaging technologies.

HBM3E provides maximum capacity of 36GB and maximum per-pin data rate is 9.6Gbps, where maximum bandwidth exceeds 1.23TB per second, which is a 1.4times improvement compared to HBM3 both in terms of capacity and bandwidth. SK …

2024年3月1日 · 目前迭代至hbm3的扩展版本hbm3e，提供高达8gbps的传输速度和16gb内存，由sk海力士率先发布，将于2024年量。 HBM主要应用场景为AI服务器 ，最新一代HBM3e搭载于英伟达2023年发布的H200。

Offering a high memory bandwidth and power-efficient solution, HBM3E has become a leading choice for AI training hardware. Find out why in our blog below. Table of Contents: What is HBM3E Memory? What is a 2.5D/3D Architecture? How is HBM3E Different from HBM2E, HBM2 or HBM (Gen 1)? More Changes with HBM3E; What is HBM3E Memory?

Memory type HBM3 HBM3E HBM3E is faster and more efficient HBM placements 5 6 Memory capacity (GPU) 80GB 144GB (24GB per cube) 76% increase in capacity Memory bandwidth (GPU) 3.35 TB/s 4.8 TB/s (800 GB/s per cube based on system specifications) 43% higher bandwidth. HBM3E can reach >1.2 TB/s per cube. Same compute power Table 3.

To meet this need, we present an extended version of the high-bandwidth memory-3 (HBM3 DRAM), HBM3E, which achieves a 1280GB/s bandwidth with a cube density of 48GB.

SK海力士 发布HBM3E，提供8Gbps传输速度和16GB内存，将于2024年量产。 HBM3E是HBM3的扩展版本，为高性能计算和人工智能应用提供突破性性能。 HBM（高速宽带存储器）以人工智能（AI）服务器为主要应用场景。 最新一代HBM3e已搭载于 英伟达 2023年推出的H200中。 根据 Trendforce 数据，2022年AI服务器出货86万台，预计到2026年将突破200万台，年复合增长率达29%。 AI服务器激增带动HBM需求飙升，平均容量提升。 预计25年市场规模达150亿美元， …

Samsung is leading the pack with its latest 5th generation high bandwidth memory (HBM) device: HBM3E 12H DRAM. This device is designed to give a significant edge to high-demand systems, data centers, AI applications, and advanced graphics-unit processors that power AI computing.