EPEPS is the premier international conference on advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems. Over …

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also …

2024年6月14日 · 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems. October 6-9, 2024, Toronto, Canada, www.epeps.org. EPEPS is the premier …

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The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in …

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also …

EPEPS is the premier international conference in the North America region with a focus on advanced and emerging issues in electrical modeling, analysis, synthesis and design of …

In this tutorial we review the fundamentals of the latency insertion method and explore applications related to new technologies. Recent advances, several examples and case …

Read all the papers in 2008 IEEE-EPEP Electrical Performance of Electronic Packaging | IEEE Conference | IEEE Xplore

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also …