2020年3月13日 · IEEE Std 1838 provides a modular test access architecture, in which dies and interconnect layers between adjacent stacked dies can be tested individually. The focus of the standard is testing the intra-die circuitry as well as the inter-die interconnects in pre-bond, mid-bond, and post-bond cases in pre-packaging, post-packaging, and boardlevel ...

IEEE1838 提出了3D DFT的标准，针对多个裸die封装在一起缺少控制和观测IO的问题，定义了标准的测试接口和内部测试结构，保证可以通过最少的外部接口pad/bump/ball/pin，借助标准的DFT结构测试stack中的每一个裸die，保证了量产的测试覆盖率。 本文不会具体介绍IEEE1838标准，而是从一个量产测试工程师的角度，记录一些学习笔记和个人理解。 只是个人理解，无所谓正确与否。 对于一个独立的裸die，需要有. 因为裸die互连之间的信号是用pitch很小的fine pitch …

2024年9月20日 · STAP应从芯片内的IEEE Std 1838 PTAP控制器和寄存器架构中进行选择和配置，并且PTAP控制器应保持在活动串行扫描路径中，要求扫描路径到STAP TDO信号（TDO_S1_int）的源必须放置在PTAP寄存器架构的寄存器架构之后（参见图11中为TDI_Sk_int提供源的mux的输出）。

2020年6月15日 · At the time, our entire 3D-DfT solution was based on IEEE Std 1500, i.e., the wrapper standard for embedded cores in SoCs. As Cadence has tooling for hierarchical test of core-based SoCs, we could reuse that, with some adaptations, for 3D die stacks too.

IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits Amendment 1: Testing of Interconnects External to Multi-Die Assemblies using Boundary-Scan Register (BSR) Segments

2023年5月25日 · The proposed standard is based on, and will work with, digital scan-based test access and they plan to leverage existing test access ports (such as IEEE Std 1149.x) and on-chip design-for-test (such as IEEE Std 1500) and design-for-debug (IEEE P1687) infrastructure wherever applicable and appropriate.

2019年11月7日 · If you want to learn more about IEEE Std 1838, here is a list with resources. The standard itself: IEEE Std 1838. Purchase or download. The semiconductor industry is preparing itself for three-dimensional stacked integrated circuits (3D-SICs), especially fueled by the advent of technologies based on Through-Silicon Vias (TSVs).

Chip-Iet based multi-die 3DIC design methodology is the paradigm shift in semiconductor manufacturing that enables scalable design integration for SysMoore era.

IEEE Std 1838 provides a modular test access architecture, in which dies and interconnect layers between adjacent stacked dies can be tested individually. The focus of the standard is testing the intra-die circuitry as well as the inter-die interconnects in pre-bond, mid-bond, and post-bond cases in pre-packaging, post-packaging, and boardlevel ...

IEEE Std 1838（TM）-2019标准化了3D测试访问的强制性和可选片上硬件组件。 其目的是在未来为一种正式的、计算机可读的语言开发一种标准，其中可以指定和描述三维测试设计（3D DfT）硬件的实现选项。 [B5]中描述了语言/数据结构的概念。