It integrates single boost Power Factor Correction (PFC) stage and inverter stage in one DIP 36x21D package with DCB substrate, to provide excellent thermal conduction and electrical isolation for home appliances and industrial drives.

Fully featured interleaved PFC IPM; High PFC switching up to 60 kHz to reduce inductor size; Excellent thermal performance with DCB substrate; Easy heatsink mounting in combination with CIPOS™ Mini inverter IPM

600 V, 30 A CIPOS™ Mini 3 Phase Open Emitter intelligent power module (IPM) with TRENCHSTOP™ IGBT and built in NTC in MDIP-24 DCB package.

ipm 的 dcb 陶瓷衬底板可提供更大的载流能力，具有更好的散热性能。目前市场上已能批量供应 800a/1200v 的通用和专用 ipm 模块，其最高水平已达到 1200a/1800v 和 1600a/1500v。

2020年6月1日 · The new IPM provides a compact Infineon Technologies CIPOS™ (Control Integrated POwer System) Mini IPM package measuring 21 mm x 36 mm. All of the semiconductor chips are optimized for the package, and owing to the DCB substrate, it has excellent heat dissipation characteristics.

Fully featured interleaved PFC IPM; High PFC switching up to 60 kHz to reduce inductor size; Excellent thermal performance with DCB substrate; Easy heatsink mounting in combination with CIPOS™ Mini inverter IPM

It provides fully featured compact inverter solutions with DCB substrate to enable excellent thermal performance and higher power capability along with excellent thermal conduction and electrical isolation. Performance is optimized for home appliances and industrial drives.

integrated intelligent power module (IPM) and the basic requirements for operating the products in a recommended mode. This is related to the integrated components, such as IGBT or gate drive IC, as well as to

DCB (direct copper bond) substrate is adopted for good thermal performance considering the small package size. This paper provides an overall description of the new PFC-integrated IPM (IM564-X6D) as well as the performance, power ratings and characteristics of …

The new IPM is UL approved (UL 1557 File E314539) and RoHS compliant. DCB (Direct Copper Bond) which is a substrate with good thermal conductivity is adopted as a substrate for high thermal performance. Figure 3 shows the cross section view of the new IPM. All of the major heat sources like IGBTs and Diodes are mounted on DCB, in order to