At the 70th International Electron Devices Meeting (IEDM) this year, TSMC Executive VP and Co-COO, Dr. Y.J. Mii, delivered a visionary keynote highlighting the semiconductor industry’s promising future and exploring new technological frontiers in device architecture, lithography, and system integration.

台积电（tsmc）n2与下一代soic、英特尔emib-t、meta 3d堆叠内存、cfet、二维材料等 半导体行业的成就并非来自一夜突破，而是源于持续叠加的巨大飞跃——其发展速度之快，堪称人类历史上任何其他产业难以企及。

Powered by the principle of technology scaling, this field continues to push boundaries, enabling transformative applications in AI, HPC, 5G/6G, autonomous driving, IoT, and more. As we progress through time, scaling evolves, unlocking new levels of chip efficiency and performance.

2024年12月14日 · TSMC revealed additional details about its N2 (2nm-class) fabrication process at the IEEE International Electron Device Meeting (IEDM) earlier this month. The new production node promises a 24 to...

2025年2月5日 · TSMC is the apex predator of advanced logic. A key advantage for them is superior process technology. Their first GAA process node, N2, looks like it will continue this trend. Given the prime presentation slot, in the largest hall directly after keynotes, they mostly victory-lapped the node but gave a few interesting details as well.

IEDM 2024 Tipsheet of Technical Highlights. Paper 2.1, TSMC’s New, Industry-Leading 2nm CMOS Logic Platform. Individual images: Paper 2.2 Extremely Scaled Transistors from Intel. Paper 2.5, TSMC’s Fully Functional Monolithic CFET Inverter at 48nm Gate Pitch. Paper 4.2, A Step Toward HZO-Based Memories.

Driven by markets diversification and front-end transistor scaling challenges, wafer Level System Integration enables system scaling complementing Moore’s Law transistor scaling. This tutorial …

Today at IEDM 2024, our Executive VP and Co-COO, Dr. Y.J. Mii, delivered a captivating keynote on the semiconductor industry outlook and technology frontiers. Here’s the opening video of his...

• An industry-leading 2nm CMOS logic platform, from TSMC • Extremely scaled nanosheet transistors, from Intel • Scaled 4F 2 DRAM with new vertical channel transistors, from Kioxia Corp./Nanya Tech. Corp.

2025年1月31日 · Watch the official IEEE IEDM 2024 Conference video for a preview of what’s to come. OnDemand Registration is closed. closed on January 31. Don’t miss important notifications and information on the IEDM Conference. Login to IEDM Online and add the sessions you wish to view to your agenda. More information here. OnDemand Access Ends March 31, 2025.