Download scientific diagram | Several design studies for stress-relieve in clips (Fraunhofer IISB). from publication: Quality of pressure sintering | Pressure sintering is relatively new...

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Using new materials for bond wires like copper, composites, or alloys, we aim for improvement of the application’s lifetime. Furthermore, by bonding parameters, geometry, material, and others, …

2024年7月22日 · 近日，德国研究所Fraunhofer IISB在碳化钽涂层技术的研发上取得了突破，开发了一种喷雾涂层方案，具有优于CVD沉积方案的灵活性及环保性，并且已实现商用。

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在Erdmann教授的指导下，实验室在新型光栅结构设计上获得突破性进展,设计了130nm带宽效率高于98.5%的二维宽带全介质膜光栅；开展了不同类型结构缺陷的光栅模拟计算及其对光栅近场 …

Our portfolio of services contains all standard soldering techniques for chip attachments, as well as pressureless and pressure assisted sintering and next-generation silver direct bonding …

Das Fraunhofer IISB in Erlangen ist spezialisiert auf Wide-Bandgap-Halbleiter und effiziente Leistungselektronik. Material- und Bauelemente-Knowhow verschmilzt hier mit komplexer …

The exhibition allows students to explore topics in depth, gain confidence, and demonstrate what they’ve learned. Parents, teachers, and fellow students attend the event, making it a lively and …

What is Power Cycling? What kind of failure effect? What kind of process? What triggers the failure? How can the failure be described? ... Wire bonding remains hot!