The 2835 and 2367 Pro broadband plasma defect inspection systems provide industry proven performance for optical patterned defect inspection, enabling discovery and monitoring of yield-critical defects on ≥ 45nm logic, memory and specialty devices.

KLA-Tencor 236X Defect Inspection Parts For Sale (2351, 2360, 2365, 2367)Parts < KLA-Tencor 236x Parts

Broadband Patterned Wafer Inspection System defect inspection for design nodes ≥65nm. Based on the widely adopted 23XX platform, the 2367 captures yield-impacting defects on critical front-end-of-line (FEOL) and back-end-of-line (BEOL) layers and serves as a critical process qualification and systematic defect

2367 宽波段紫外/ 可见光明场检测仪可以为≥65nm 的设计节点提供高效的在线图案缺陷检测及其所需的灵敏度和高采样产量。 2367以广泛采用的23XX 平台为基础, 能够在前段(FEOL )和后段(BEOL)工艺层上发现良率缺陷,并且为光刻图案提供关键的工艺认证和系统性缺陷识别。

KLA / TENCOR 2367 is a non-contact, fully automated inspection system designed to detect and measure defects and patterns on photomask and wafer surfaces. It features a variety of advanced features such as pattern recognition, image enhancement, automated software, and "Point & Look" module to provide superior accuracy and speed.

KLA/TENCOR 2367是一个非接触式、全自动的检测系统，旨在检测和测量光掩模和晶圆表面的缺陷和图桉。 它具有模式识别、图像增强、自动化软件和"点与外观"模块等多种高级功能,可提供卓越的准确性和速度。

2018年9月19日 · KLA-Tencor KLA 2367 Inspection, Measurement Tool. At Bridge Tronic Global, we leverage our extensive network and industry expertise to source high-quality semiconductor manufacturing equipment from trusted suppliers worldwide.

KLA/TENCOR 2367是一個非接觸式、全自動的檢測系統，旨在檢測和測量光掩模和晶圓表面的缺陷和圖案。 它具有模式識別、圖像增強、自動化軟件和「點與外觀」模塊等多種高級功能,可提供卓越的準確性和速度。

KLA-Tencor (NASDAQ: KLAC) 近日宣布推出其第五代的寬頻 UV/可見光明視野檢測系統－2367，可讓晶片製造商在維持其獲利能力的同時，以更快的速度創新與提昇產能。

2025年1月28日 · KLA-Tencor 2367 Brightfield Inspection - Power Requirements: 208 V, 16 A, 50 / 60 Hz, 3 Phase - CE Marked: Yes - ORS Upgrade - 25 cassette HW 200 mm - GEM/SECS and HSMS Model - Enable .12 , .62, .39 Picels 2017 Vintage