
KLA BBP 40th Anniversary
The 23xx Series introduced broadband ultraviolet (UV) illumination technologies to help chip manufacturers tackle the challenges associated with the adoption of copper for interconnects, the reduction of design nodes to 100nm and the transition to 300mm wafers.
BBP: 40 Years of Discovery at the Speed of Light™ - KLA
2024年6月25日 · The 23xx Series utilized broadband ultraviolet (UV) illumination technologies to help chip manufacturers tackle the challenges associated with production adoption of copper for interconnects, the reduction of design nodes to 100nm and the transition to 300mm wafers during the first half of the decade.
Defect Inspection - KLA
KLA has a comprehensive portfolio of defect inspection and review systems for advanced chip manufacturing, including additional Surfscan ® unpatterned wafer inspection systems and broadband plasma optical patterned wafer inspectors.
KLA-Tencor 236X Defect Inspection Parts For Sale (2351, 2360, …
XYI - XY Interpolator Bd. We have more 23xx parts not listed as well... Top.
产品 - KLA
5G 的超可靠、低延迟通信可为我们的移动设备提供更高的数据传输速度和带宽。 我们的解决方案可确保此类设备满足苛刻的质量和可靠性标准。 我们的工艺控制和工艺促进解决方案旨在提高电子行业的创新速度。 我们协助客户达到领先的产品功能。 准备好了吗? Copyright © 2025 KLA Corporation. All Rights Reserved. KLA提供全方位的产品组合,检测、量测与数据分析系统,致力于帮助制造商们在整个IC制造流程中更好地进行良率管理。
KLA-Tencor rolls brightfield inspection - EE Times
2006年3月8日 · An extension of KLA-Tencor’s 23XX platform, the new 2367 delivers increased sensitivity and a faster data rate to help chipmakers capture critical layer defects earlier. The 2367 also features a new image computer and a time delay integration sensor that enable the market's fastest data rate for tighter, faster process control.
KLA-TENCOR 最新的 UV/可見光明視野檢測機台為先進的 IC 製造 …
KLA-Tencor (NASDAQ: KLAC) 近日宣布推出其第五代的寬頻 UV/可見光明視野檢測系統-2367,可讓晶片製造商在維持其獲利能力的同時,以更快的速度創新與提昇產能。
广泛采用的23xx平台为基础,能够在前段(feol)和后段(beol)工艺层上发现良率缺陷,并且为光刻图案提供关键的工艺认证和系 统性缺陷识别。 灵活多变的2367检测仪还可辅助补充KLA 28XX全光谱深紫外/紫外/可见光明场检测仪,形成混合匹配的检测策略。
KLA-Tencor Launches 2830 and Puma 9500 Series, eDR-5210
2009年7月13日 · -- Design-aware capability, proprietary access to optical images from KLA-Tencor inspection systems and live SEM* images together lead to faster root-cause understanding of critical patterning problems at the 3Xnm and 2Xnm nodes.
Allows on-SEM sensitivity tuning of recipes for KLA-Tencor’s 23xx & 28xx and higher series bright-field inspectors and Puma 9xxx series dark field inspectors. Wafers need to be on the SEM in order to for this option to function. Optimized recipes are directly available on the inspector.
- 某些结果已被删除