The AIT XUV is KLA-Tencor's next-generation double-darkfield optical inspection tool incorporating UV illumination to achieve the critical sensitivity requirements needed for the 65-nm node. The AIT XUV provides detection capability for current-layer defects at speeds up to three times faster than the prior-generation AIT XP system.

KLA’s defect inspection and review systems cover the full range of yield applications within the chip manufacturing environment, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring.

The AIT II, an advanced system for patterned process tool monitoring for 0.18 µ and smaller geometries, has bridge capability to 300-mm wafers. By enabling the immediate detection of process tool excursions, the AIT II minimizes the number of wafers exposed to out-of-control process conditions, offering integrated circuit (IC) manufacturers ...

KLA-Tencor AIT I 是一种高端的晶圆测试和计量系统，主要用于半导体制造过程中的缺陷检测与分析。 该系统具备多种先进功能，包括自动化检测、高精度测量以及多通道光学成像技术。

KLA-Tencor AIT XP 晶圆检测仪 是一种先进的晶圆测试和计量系统，专为半导体制造过程中的缺陷检测和过程控制而设计。 该系统利用高精度的成像技术和专有算法，能够快速、准确地识别和分析晶圆上的缺陷，从而提高生产效率和产品质量。

2024年9月23日 · KLA-Tencor AIT II 晶圆检测仪 是一种先进的晶圆测试和计量系统，专为半导体行业设计。 该系统具有多种功能和特点，使其在晶圆缺陷检测和过程控制方面表现出色。

KLA-TENCOR AIT II (200mm/300mm) PATTERNED SURFACE DEFECT INSPECTION SYSTEM consisting of: - Model: AIT II - Wafer Size: 200mm - 150/200mm Open Handler - Software Version 5.3.17.4 - Double Darkfield Inspection Tool - SECS II / GEM Communication Interface - Vacuum Chuck / Locator for 200mm Wafers

Adjusts dynamically to all die regions to deliver maximum sensitivity and improved detection of killer defects in a single scan, regardless of pattern density. Features faster recipe setup, fewer setup parameters, improved recipe robustness, and user-friendly setup templates.

kla/tencor ait uv是一种下一代计量设备，利用先进的成像、光束剖面图和图样能力测量具有纳米精度的晶片，以确保生产的晶片符合必要的规格。 KLA / TENCOR AIT UV 晶圆测试仪 用于销售价格 #9285827 > 从 CAE 购买

2001年7月3日 · Using proprietary technology KLA-Tencor calls NexTek, the AIT XP can inspect an entire patterned wafer in 80 seconds with a high rate of defect capture, thereby increasing throughput as much as 75 percent compared to current systems, according to KLA-Tencor.