Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.

Lumina optimizes processes through connectivity with KLA’s comprehensive AI-enhanced portfolio of defect inspection, metrology, and intelligent software solutions. This optimizes yield, accelerates delivery cycles and improves overall profitability throughout the leading edge IC substrate and PLP manufacturing workflow.

noise suppression capability. Low-angle oblique illumination provides significantly higher signal from the wafer surface than from underlying layers, thereby minimizing noise from grain, pattern and color variation while providing surface selectivity to limit the …

2022年12月6日 · KLA’s comprehensive portfolio of inspection, metrology & data analytic systems helps manufacturers manage yield through the entire IC fabrication process.

Inspection tool sensitivity can be described as being directly proportional to defect signal and inversely proportional to wafer noise. Maximizing the signal-to-noise ratio — or, the contrast between a defect and its surroundings — is necessary for the successful detection of critical immersion litho defects.

For 40 years our broadband plasma (BBP) patterned wafer inspectors have been at the forefront of defect discovery for the semiconductor industry. Introduced in 1984, the KLA 2020 was the first automated patterned wafer inspection system for chip production, replacing manual inspection by human operators.

2007年7月9日 · The new HRP-350 platform includes multiple enhancements that reduce noise, enabling much higher profile measurement precision, sensitivity and repeatability. A new isolation table, advanced acoustic barrier and damping materials, and a new probe sensor assembly all contribute to improved noise floor performance compared to the previous HRP-340 ...

2008年7月8日 · As the tenth generation e-beam inspection system from KLA-Tencor, the eS35 features improved sensitivity and advances in on-board review and binning, along with substantial throughput gains, to accelerate yield of 4Xnm and 3Xnm devices.

2024年9月25日 · 半导体检测领域的领头羊kla科磊（简称kla）的产品线广泛且深入，覆盖了半导体制造和相关电子行业的多个关键环节。 KLA的产品线主要包括用于检验、测量、数据分析的系统以及软件等，这些产品广泛应用于IC、晶圆和掩模的研发和制造过程中。

The C205 leverages a tunable broadband illumination source, selectable optics, a low noise sensor, and advanced algorithms to capture yield-limiting defects, helping accelerate characterization and optimization of new processes, design nodes and devices from R&D early learning through high volume manufacturing.