Laser Direct Structuring (LDS) is a process where an antenna design can be directly transferred onto the 3D surface of an injection-molded structure through the operation of a laser beam, therefore making prototyping and production processes much more efficient.

Laser Direct Structuring (LDS) is a manufacturing process in which a conductive trace can be implemented directly on an injection-molded plastic. The key benefit of this technology compared to the traditional technologies (Stamped Metal or Flexible Printed Circuit) is that the LDS process allows full 3D structures, therefore enabling the ...

With the help of LPKF Laser & Electronics SE’s laser direct structuring, a leading process in molded interconnect device (MID) technology, conductive traces can be produced on the surfaces of injection-molded parts. This provides a unique way of integrating mechanical and electronic functions on a molding.

2023年3月15日 · The LDS process is short, easy to operate, highly flexible in production, and has high line width and line spacing precision. It is currently one of the main production processes for three-dimensional circuit devices and molded interconnect devices (MID).

LDS材料是一种内含有机金属复合物的改性塑胶，激光照射后，使有机金属复合物释放出金属粒子。 有机金属复合物的特性：①绝缘性；②不是催化性活性剂；③抗可见光性；④可以均匀分散在塑料基体中；⑤激光照射后能释放金属粒子；⑥耐高温，耐化学性；⑦低毒；⑧无逸出，无迁移，抗提性好。 2. LDS原材料制作流程： 设计灵活,节省空间：三维电路载体，可供利用的空间增加；器件更小、更轻；功能更多，设计自由度更大，有可能实现创新性功能。 柔性制造：印制 …

2024年2月20日 · LDS is a process in which a conductive trace is inscribed directly on an injection-molded plastic. Compared to traditional technologies, like stamped metal or flexible printed circuits, the key benefit of LDS technology is that entire 3D structures can be manufactured, offering the flexibility to integrate complex mechanical designs in ...

2020年10月21日 · LDS 技术是由德国LPKF Laser & Electro nics AG 集团发明，利用计算机按照导电图形的轨迹控制激光的运动，将激光投照到模塑成型的三维塑料器件上，在几秒到几十秒的时间内，活化出电路图案。 对于手机天线设计与生产，简单说就是在成型的塑料支架上，利用LDS 技术可以直接在支架上镭雕、化镀形成金属天线。 具体的LDS 工艺如下图所示。 首先将LDS 功能塑料注塑成型，继而将激光光束直接投射在注塑件表面，按照预设计图案控制激光行进轨迹，被 …

laser-supported process for producing three-dimensional MIDs (molded interconnect devices): the LPKF LDS process. Circuit layouts can be created on complex three-dimensional carrier structures using LPKF laser direct structuring. The laser beam inscribes the layout directly on the plastic component. The weight and dimensions of

LDS consists of three main phases: injection molding, laser activation, and metallization, followed by additional steps, such as surface inishing and final product inspection. The process begins with designing and fabricating the desired three-dimensional component with an LDS-capable thermoplastic blended with a metal-organic compound.

Use a patented laser etching machine to etch out the designed circuit. Usually this step can be called metallization. The principle is to use a laser to etch away the plastic on the surface of the material, so that the metal components wrapped in the plastic can be revealed.