With the help of LPKF Laser & Electronics SE’s laser direct structuring, a leading process in molded interconnect device (MID) technology, conductive traces can be produced on the …

LPKF-LDS 激光直接成型是一种制造三维模塑互连器件的领先工艺，其直接在注塑成型器件表面形成三维导电结构，这种工艺为集成机械结构和功能电路提供了独特的解决方案。

Typical electro-mechanical functions such as keys, plugs and other connection elements can thus be integrated side by side in a component that serves as a molded interconnect device. …

With LPKF’s Laser Direct Structuring process (LDS) it is possible to produce circuit layouts on geometric or free-form shapes. Designers are enabled to meet ongoing demands for …

The Nextra® MID module offered by FlowCAD (www.flowcad.de) is a platform that can be used to produce three-dimensional STEP data sets containing closed out-lines of the conductive path …

LPKF Fusion3D 1500设备结合了LPKF高效加工单元与灵活紧凑的移动系统，采用LDS最前沿技术，将对元器件加工长度的限制彻底清除。 采用LDS工艺可减少产品使用的元器件数量，令产 …

Developing molded interconnect device components is a challenging procedure no matter which process or technology is used. This LDS MID Design Guide helps interdisciplinary developers …

LPKF Fusion3D 1100的出现，让我们拥有进入LDS时代经济高效的设备。 从一片简单的塑料器件上产生精确的导电轨迹，使之成为智能手机天线：LPKF LDS工艺不但开创了一项崭新的产品 …

The laser-based LPKF-LDS method meets exactly these needs with ultra-fine precision and high reliability. MID technology makes healthcare devices more convenient.

users are expecting increasing amount of novel functions available inside trend-looking compact covers. The LPKF-LDS technology offers great potential for miniaturization and a very high …