Vitrion | Precision Glass Microprocessing with LIDE® Technology
Specialized foundry service offering high-precision micro-features in glass using proprietary LIDE® technology. Serving semiconductor, microfluidics, and display industries with crack-free …
LPKF Vitrion S 5000
Vitrion S 5000 系统是现阶段以及未来采用 LIDE 工艺的半导体封装和应用的生产系统解决方案。 高性能激光系统以无与伦比的精度和速度加工玻璃晶圆，并且不会对玻璃产生任何微裂隙：完 …
LPKF Vitrion S 5000 Gen2 by vitrionOEM - Issuu
2022年7月13日 · The LPKF Vitrion S 5000 Gen2 comes with the ability to perform the full spectrum of functionality and work packages required to use the LIDE technology to its full …
Vitrion S 5000 laser system for glass processing | LPKF
LIDE (Laser Induced Deep Etching) production system for the Semiconductor Industry. Available glass wafer formats: 100 mm/150 mm, 200 mm/300 mm.
LPKF Vitrion 5000 激光系统特别为加工易碎的玻璃基材 而设计 , 可加工最大幅面为 510 mm x 510 mm 的玻璃面板 或 18 英寸的晶元。
LIDE Laser Induced Deep Etching - LPKF
The LPKF Vitrion M 5000 Gen2 system provides flexibility in processing substrates, including deep microstructures in glass for small samples or full panels. It's comfortable loading and …
LIDE激光诱导深度蚀刻技术用于薄玻璃加工_德国LPKF乐普科
LPKF Vitrion S 5000 Gen2是一款专为半导体行业批量生产而设计的系统，该设备装配了完全自动的晶圆基材上下料, 集成了自动激光工艺监控和基材对准等功能，符合SEMI行业标准。
micro-processing technology: Laser Induced Deep Etching (LIDE®). This patented technology makes it possible to machine highly precise micro-holes or cuts through the entire thickness of …
LIDE® Glass Processing Technologies & Capabilities | Vitrion
Discover our proprietary Laser-Induced Deep Etching (LIDE®) technology for precision glass microprocessing. Enabling defect-free structures with aspect ratios up to 1:50.
LIDE® Glass Solutions: Applications & Products | Vitrion
Specialized glass microprocessing for semiconductor, display, and microfluidic applications. Precision TGV wafers and custom solutions with industry-leading aspect ratios up to 1:50.