介电质刻蚀技术用于在绝缘材料上雕刻图案，以便在半导体器件导电部分之间形成阻挡膜。 对于先进器件，这些结构可能极高、极薄，并且涉及复杂、敏感的材料。 目标构件轮廓的微小偏差——即使是原子级的偏差——也会对器件的电气性能造成负面影响。 为了精确制造出这些极具挑战性的结构，泛林集团Flex ® 产品系列提供多种差异化技术和以应用为核心的功能，适用于关键介电质刻蚀应用。 针对某些应用，我们的Reliant ® 翻新产品系列已经推出一些特定型号，以更低的持有 …

To precisely create these challenging structures, Lam’s Flex ® product family offers differentiated technologies and application-focused capabilities for critical dielectric etch applications. For some applications, select models are also available through our Reliant ® Systems as refurbished products, providing lower cost of ownership with ...

Lam’s VECTOR ® PECVD products are designed to provide the performance and flexibility needed to create these enabling structures within a wide range of challenging device applications. For some applications, select models are also available through our Reliant ® Systems as refurbished products, providing lower cost of ownership with the ...

2019年10月29日 · Lam Research通过专利刻蚀技术-变压器耦合等离子（TCP，transformer coupled plasma）提供高水平的刻蚀，巩固了Lam Research在半导体业界的地位。 目前Lam Research占有全球刻蚀设备市场一半以上的市场份额。

絶縁膜エッチングは新材料の登場、プロセスインテグレーションの複雑化、微細化の進行などにより、いくつもの難しい技術課題を乗り越えなければ成りません。 このような新しい材料の導入や、プロセスインテグレーションにより積層膜をエッチングする必要があります。 しかも、多くの場合、特定の部分だけを削れるよう複数材料間の選択加工が必須になります。 半導体メーカーはウェハあたりのトータルコストを削減するために、一つの工程で複数の膜を一括して …

2024年8月16日 · 泛林半导体（Lam Research）以刻蚀设备起家，通过自主研发和多次并购成长为半导体设备行业巨头。 泛林 半导体于1980年成立，1984年在美国纳斯达克证券交易所上市。

Model Name: 2600 e6 Flex FXP to HXE Upgrade Kit; Wafer Size: 300; Configuration: Upgrade Kit to FLEX HXE - OX Pillar Etch; Group: Electronic; Category: Semiconductor Fabrication; Family: Etch Equipment; Type: Plasma Etch System; Manufacturer: Lam Research

FPE应该是Field process engineer，现场工艺工程师，应该是在客户端fab厂负责设备工艺。Lam是外资半导体设备知名企业，作为职业起步应该是不错的选择。后面可以跳到国内半导体设备厂，或者fab厂。

Xe lam là loại xe thùng nhỏ có 3 bánh xe, gồm một cabin cho tài xế ngồi lái phía trước và một thùng xe để chở khách hay chở hàng phía sau, có thể chở từ 8 đến 10 hành khách. Phân chia 3 bánh thì một bánh xe đặt phía trước, người lái có thể điều khiển để quẹo trái hay phải, còn hai bánh sau chịu đựng phần thùng xe.

FREMONT, Calif., July 31, 2024 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today extended its leadership in 3D NAND flash memory etching with the introduction of Lam CryoTM 3.0, the third generation of the company's production-proven cryogenic dielectric etch technology.