Wafer level packaging (WLP) technology offers protection of delicate MEMS structures from ambient environment, providing improved reliability, performance, and reduced cost benefits to meet real world requirements. In simple terms, WLP consists of bonding a cap or a lid wafer on top of a MEMS wafer.

2012年5月29日 · In this study, several crucial WLP technologies are disclosed in detail, including Wafer to Wafer (W2W) bonding, wafer level wire bonding, wafer level compound molding and lapping. Simplified and conceptual process flow of MEMS WLP and development approaches are introduced and explained.

Wafer level packaging is where a die is packaged while still in wafer form, either singly or combined with additional dies or other components such as discrete passive devices, or functional components like micro-electromechanical systems (MEMS) or radio-frequency (RF) filters.

Aluminum-Germanium (AlGe) eutectic wafer bonding is the most widely used wafer-level packaging process for MEMS gyroscopes in high volume production today. The history behind its usage for wafer bonding dates back over 20 years.

Read how Atomica's Wafer Level Packaging expertise allow it to integrate up to 6 wafers. WLP is key technology at Atomica, routinely achieving over 99% hermeticity.

In this paper, several significant WLP technologies, including wafer to wafer (W2W) bonding, wafer level wire bonding, wafer level compound molding, and compound lapping, are disclosed in detail. A general concept of MEMS WLP assembly process flow …

WLP of MEMS Micro electro mechanical systems (MEMS) devices, also known as micromachines, are typically fragile, often containing moving parts that can be damaged during dicing. Wafer level packaging (WLP) prior to wafer dicing can provide protection from particles and dicing slurry, while significantly reducing form factor and

Wafer level packaging (WLP) prior to wafer dicing can provide protection from particles and dicing slurry, while significantly reducing form factor and reducing the overall die cost. Increasingly, many MEMS devices, such as microsensors, require a vacuum or …

2012年5月1日 · In this study, several crucial WLP technologies are disclosed in detail, including Wafer to Wafer (W2W) bonding, wafer level wire bonding, wafer level compound molding and lapping. Simplified and...

• Market-leading DRIE etch processes to define MEMS structures and vent holes, with high etch rates, low feature tilt and unique ClaritasTM end-point system. • Low temperature PECVD compatible with temperature-sensitive MEMS devices • HF or XeF 2 vapor etch processes can be integrated onto production-proven cluster systems