This paper highlights the key advantages of the three-dimensional (3D) MMIC technology in the millimeter-wave frequency band and demonstrates recently developed compact 3DMMICs. …

Novel technology turning MMIC --- 3D Smaller footprint... Lower cost...... Better performance.........

We present a highly integrated quasi-millimeter-wave receiver MMIC that integrates 22 circuits in a 3 x 2.3 mm area using three-dimensional MMIC (3D-MMIC) technology.

Since 2008, an aggressive and realistic development of 3-D MMIC Wafer Level Chip Size package (WLCSP); for extremely low cost and surface-mount compatible MMIC products, has …

In this paper we present a fully CMOS-compatible fabrication process for GaN-on-Si monolithic microwave integrated circuits (MMICs) on 200-mm-diameter wafers.

This paper describes the cost effective 77 GHz transmitter and receiver MMIC (monolithic microwave integrated circuit) that uses a three-dimensional MMIC technology optimized for flip …

The two dimensional monolithic microwave integrated circuits (2D MMIC) are mainly implemented in a planar fashion and use microstrip design based technology. At

Forms a hermetically Assembled IC packaged 3-D integrated circuit • Enables integration of different MMIC technologies WLP provides low cost, high volume, hermetic packaging

Basic structure of 3D-MMIC. A highly integrated frequency quadrupler MMIC that uses three-dimensional MMIC (3D-MMIC) technology is presented. It consists of four driver amplifiers, two...

2023年8月30日 · 相对于传统平面型的金丝键合焊接的MMIC应用，三维（3D）多芯片互连封装MMIC以其高集成度、低损耗、高可靠性等性能优势，正逐步在先进电路与系统中得到应用。