TGVs made by Corning allow Menlo to shrink the size of its products by more than 60 percent compared to traditional wire-bond packaging technologies, making it particularly well-suited for applications where increased channel density and reduction …

There is an excellent opportunity to leverage TGV technology and the insulating properties of glass, to address next generation needs for RF components. Multi-bands multi-standards with carrier aggregation, WiFi/GPS coexistence, and LTE-U …

The two companies have demonstrated the successful integration of Through Glass Via (TGV) packaging technology, enabling the expansion of Menlo’s high-performance RF and power products to ultra-small wafer scale packaging.

By utilizing the stiffness and adjustable CTE of glass substrates, as well as continuously reducing via size that can be made in a panel format, opportunities to manufacture glass TGV substrates in a panel format increase. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows.

两家公司共同发布展示了成功整合的玻璃通孔（TGV）封装技术，使Menlo的高性能RF和功率产品扩展至超小型晶圆级封装。 TGV相比传统的键合封装技术，使Menlo的产品尺寸缩小了60%以上，使其更理想地适用于那些信道密度增长，同时尺寸、重量、功率和成本降低的 ...

2018年12月6日 · TGV allows Menlo to shrink the size of its products by more than 60 percent compared to traditional wire-bond packaging technologies, making it particularly well-suited for applications where...

2018年8月8日 · TGV allows Menlo to shrink the size of its products by more than 60 percent compared to traditional wire-bond packaging technologies, making it particularly well-suited for applications where increased channel density and reduction …

TGVs made by Corning allow Menlo to shrink the size of its products by more than 60 percent compared to traditional wire-bond packaging technologies, making it particularly well-suited for applications where increased channel density and reduction …

早在 2018 年，康宁和专注于数字微动开关（DMS）的美国公司 Menlo Micro 率先宣布成功运用 TGV 技术实现高性能射频和功率产品的超小型晶圆级封装。 与传统的引线键合封装技术相比，TGV 使其产品尺寸缩小了 60%以上、封装寄生效应降低 75%以上，适用于电池管理、家庭自动化、电动汽车、军事和专业无线电、5G 基站和物联网等不同领域。 全球第一大玻璃晶圓切割拋光厂商德国计划光学 (Plan Optik)，多年深耕 MEMS 封装玻璃晶圓，客户包括全球 MEMS 龙头 …

TGV allows Menlo to shrink the size of its products by more than 60 percent compared to traditional wire-bond packaging technologies, making it particularly well-suited for applications where increased channel density and reduction of size, weight, power, and cost are critical.