2014年1月1日 · Techniques for measuring stresses in thin films, including both X-ray diffraction and substrate curvature methods, and the physical processes that lead to these stresses, including thermal, epitaxial and intrinsic processes, are described.

2018年3月5日 · Evaluation methods, implying wafer curvature, x-ray diffraction, or focused ion beam removal techniques, are reviewed. Selected examples of stress evolution in elemental and alloyed systems, graded layers, and multilayer-stacks as well as amorphous films deposited using a variety of PVD and PECVD techniques are highlighted.

Stress in metal thin films causes yield and reliability problems. In severe cases, improperly controlled stress results in delamination of the metal film. This project systematically studied the intrinsic stresses in titanium tungsten (TiW) and gold (Au) films as a …

Epitaxial stresses arise when films have perfectly coherent interfaces with their substrates, i.e., when the crystal lattices in film and substrates line up perfectly. The epitaxial strain gives rise to a misfit stress, σmf, in the film. Since the film is a single crystal, one has to use anistropic elasticity to calculate the misfit stress.

The issue of stress in thin films and functional coatings is a persistent problem in materials science and technology that has congregated many efforts, both from experimental and fundamental points of view, to get a better understanding on how to deal with, how to tailor and how to manage stress in many areas of applications.

2010年3月15日 · Stress in thin films and heterostructures is often the cause for malfunction of respective applications, but enables also the controlled engineering of novel materials properties. In the last years considerable progress has been achieved in understanding the mechanisms for stress evolution and relaxation.

In this chapter, the mechanism behind stress development during film growth is investigated. This study is needed for the understanding of the reduction of film stress which is necessary to increase the mechanical reliability of TSVs. Usually metal films are used in TSVs to electrically connect the integrated circuit in the 3D structure.

2005年1月1日 · At room temperature, the metal film (500-nm-thick Cu film) is in a biaxial tensile stress state. On heating, the film tends to expand more than the substrate and the tensile stress is reduced.

2018年8月27日 · This film exhibits stress after deposition, and MEMS structures are sensitive to it. If the stress is too compressive, thin film may blister or buckle, whereas if the stress is too tensile, the film may fracture. It degrades the sensitivity, durability, reliability and overall performance of MEMS sensors/actuators.

2014年11月14日 · The failure modes of thin metal films and ceramic coatings induced by both intrinsic (growth) stresses and external effects (uniaxial tension, alternating bending, thermal treatment) were...