Mini Small Outline Package - Wikipedia
The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits. Many integrated circuits are available in the MSOP form factor.
SO、SOP、SOIC、MSOP、TSSOP、TSOP、VSSOP、SSOP、SOJ封装详解
2023年10月2日 · SOP和SOIC的规格多是类似的，现在大多数厂商基本都采用的是SOIC的描述：SOIC8有窄体150mil的（外形封装宽度，不含管脚，下同），管脚间距是1.27mm，如下：有宽体的208mil的，管脚间距是1.27mm，如下：上面两种规格主要是针对8P的，常用的14P和16P主要是150mil规格的窄 ...
转 | 芯片封装SOIC DIP MSOP DFN LCC介绍 - CSDN博客
2021年10月26日 · Mini Small Outline Package，微型小外形封装，通常缩写为MSOP，是一种常见的集成电路元器件封装形式。 微型小外形封装MSOP通常应用于8个脚、10个脚、12个脚以及最多16个脚的集成电路。
This document describes how to use the 10-Pin MSOP and 8-Pin MSOP Evaluation Board. The document is organized as follows: • Chapter 1. “Product Overview”– Important information about the 10-Pin MSOP and 8-Pin MSOP Evaluation Board. • Chapter 2. “Installation and Operation” – Includes instructions on how to get
MSOP-10 AND MSOP-8 EVALUATION BOARD | Microchip Technology
The MSOP-10 and MSOP-8 Evaluation Board is a bond-out board that allows the system designer to quickly evaluate the operation of Microchip Technology’s devices in any of the following packages: • MSOP (8- and 10-pin )
MICROCHIP TECHNOLOGY 10-PIN MSOP USER MANUAL Pdf …
View and Download Microchip Technology 10-Pin MSOP user manual online. 10-Pin MSOP motherboard pdf manual download. Also for: 8-pin msop.
MSOP Component Package - mbedded.ninja
2015年1月8日 · MSOP (Mini Small Outline Package) 1 is a family of SMD component packages with gull-wing leads. The family is a miniaturized version of the SSOP package. There are a few common variants in the MSOP family, the MSOP-8, MSOP-10, and MSOP-16. The exposed pad on this package is optional (Analog Devices have separate codes for each). MSOP-8
PA-SOCKET-MSOP-10-0.5 Chip Quik Inc. | 开发板，套件，编程器
来自 Chip Quik Inc. 的 PA-SOCKET-MSOP-10-0.5 – - 插座模块 MSOP。 DigiKey 提供数以百万计电子元器件的定价和供应信息。
The DEM-OPA-MSOP-2Bdemonstration fixture is a generic, unpopulated printed circuit board (PCB) for dual high-speedoperational amplifiers in MSOP-10packages. Figure 1 shows the package pinout for this PCB. For more information on these op amps, as well as good PCB layout techniques, see the individual amplifier data sheets. Figure 1.
10-Lead Plastic Micro Small Outline Package (MS) [MSOP] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging