
Automotive, IoT & Industrial Solutions | NXP Semiconductors
Design and scale your software-defined vehicle architectures with the new S32K5 microcontroller family and NXP CoreRide platform. Take a digital journey of EW25 and discover how NXP …
恩智浦半导体官方网站 | NXP 半导体
恩智浦全新IW610系列采用2.4/5 GHz双频Wi-Fi 6、低功耗蓝牙和802.15.4(Thread)三频配置,适合智能应用。 我们携手加速技术突破, 构建美好世界。 集成高压模拟功能和强大MCU内 …
NXP Semiconductors - Wikipedia
NXP manufactures chips for eGovernment applications such as electronic passports; RFID tags and labels; and transport and access management, with the chip set and contactless card for MIFARE used by many major public transit systems worldwide. [8]
Products | NXP Semiconductors
From microcontrollers and processors to sensors, analog ICs, and connectivity, NXP products are fueling innovation in automotive, consumer, industrial and networking
Processors and Microcontrollers | NXP Semiconductors
Complete system on-chip (SoC) processors for networking applications across carrier, enterprise, military and industrial markets. Portfolio of multimode solutions for femtocell, picocell, metrocell and macrocell base station applications. Power-efficient products for …
超薄免接触式芯片模块MOB10 | NXP 半导体
恩智浦的MOB10是第一个与现有文档生产基础设施兼容的工业大容量IC封装。 该平台是薄型和兼容模块的下一步。
产品 | NXP 半导体
恩智浦提供全面的产品系列,包括微控制器、处理器、传感器、模拟IC和连接模块,为多个行业的创新助力。 恩智浦在汽车、消费电子、工业和网络领域的贡献尤为突出。 提升您的设计水平,降低设计复杂性,同时加快产品上市速度。 我们的资源专门满足您构建综合解决方案的需求。 恩智浦技术支持团队随时准备好为您提供各种深度技术问题的支持。 恩智浦产品种类繁多,从微控制器和处理器到传感器、模拟IC和连接,正不断推动汽车、消费电子、工业和网络领域的创新发展。
恩智浦半导体-产品 | NXP
身份验证与安全 商品验证 智能标签IC NTAG ® 213/215/216 查看所有身份验证与安全产品
Build MATTER chip-tool Android APK in Ubuntu server - NXP …
MATTER chip-tool android APK is a very useful tool for commission, control the MATTER network by smart phone. Vendor can add various features into the APK. It supports build by Android Studio and command line. The official build steps can be found here: https://github.com/project-chip/connectedhomeip/blob/master/docs/guides/android_building.md.
Packages | NXP Semiconductors
Our package options range from traditional leaded and leadless packages (small outline package (SOP), quad flat package (QFP) and quad flat no-lead (QFN)) to advanced ball grid arrays using wire bond and flip-chip interconnects and wafer-level packages.
- 某些结果已被删除