Discover wafer-level optics, through-silicon-via and system in package. ams OSRAM wafer-level integration and process technologies enable high volume manufacturing of extremely precise, …

Advanced packaging technologies from ams OSRAM include: Wafer-level optics, which enable the precise fabrication of lenses for miniature light sources and detectors Through-silicon vias, …

Beyond silicon, we offer wafer sort, packaging, final test, and advanced technologies like Through Silicon Vias (TSV), die stitching, and optical filters. Contact our foundry team to discover how …

2025年2月25日 · With ams OSRAM you also get a secure long-term supply chain through in-house wafer manufacturing, advanced testing facilities, strong partnerships, and full …

HBO ® lamps for UV exposure of packaging, MEMS, and LED lithography, are used for mask aligners, advanced packaging, and wafer inspection, with lamp wattages ranging from 350W …

中国 上海，2025年2月25日——全球领先的光学解决方案供应商艾迈斯欧司朗（SIX：AMS）今日宣布，凭借AS1163独立智能驱动器（SAID）成为中国领先的智能集成系统产品汽车制造商宁 …

To make a rapid design start for your high-performance analog/mixed-signal IC prototypes, take advantage of ams OSRAM multi-project wafer (MPW) service. Reserve your place on the …

2023年12月18日 · Our ams OSRAM MPW service offers the full range of 180nm and 0.35μm specialty processes, including the recently introduced 180nm CMOS technology ("C18"). This …

Our Full Service Foundry provides a variety of production proven and industry standard process technologies. ams OSRAM is demonstrating its industry leadership in the area of analog and …

2024年8月17日 · Austria-based ams OSRAM is a multinational photonics application developer, focusing on sensors, LEDs and light-based treatment solutions. ams OSRAM is at the …