INTEGER是通过Chuck, Baffle温度及多样的化学物组合来调节选择比 (selectivity), 可以在半导体工艺中清洁high aspect ratio contact (HARC)及形成图案的dry cleaning设备. OMNIS是一款可实现对氧化膜及氮化膜等的Hard Mask底部膜进行选择性去除的高选择比的new hard mask strip设备. PRECIA作为一款用于提高晶片边缘成品率的edge Clean设备, 其优点在于较低的设备维护费用与高性能. (交易信息可能会延迟约10分钟.)

PSK#39;s dry cleaning equipment, INTEGER, enables high–aspect ratio contact cleaning and patterning in the semiconductor process by adjusting selectivity through a combination of chuck, baffle temperature, and various types of chemistry. VIEW MORE

This single-wafer process equipment enables high–aspect ratio contact cleaning and patterning in the semiconductor process by adjusting selectivity through a combination of chuck, baffle temperature, and various types of chemistry. It also provides …

독보적 세계 시장점유율 1 위인 PSK Holdings 의 GENEVA 는 검증된 안정성과 우수한 품질을 바탕으로 FOWLP 등의 warpage 공정과 고품질 제품에 대한 고객의 니즈를 충족할 수 있는 솔루션을 제공합니다.

2024年3月18日 · PSK（Phase Shift Keying，相位键控调制）是一种将数字信号转化为相位变化的波形信号的调制方式。PSK调制中，数字信号被转化为不同相位的载波信号。在接收端，通过探测载波信号相位变化来译码数字信号。PSK调制的

2024年8月27日 · Baffle，正如其名，是一款专用于Android APK包res资源混淆的开源工具，其目标是提升应用的安全性，防止敏感信息泄露。 Baffle的工作原理主要是通过对APK包中的资源文件进行重命名和重新组织，使得原本清晰明了的...

Songdi has been developing and deploying metal component technology for semiconductor processes for a long time, including product development, mold design and manufacturing to product shipment. We provide one-stop complete services to our customers.

It supports a wide process window utilizing chuck & baffle temperature controls, high & low Etch Rates (50~600/min), and good wafer Uniformity (<3.0%) Performance, low particle control, and outstanding reliability make the profier a highly attractive and effective low-cost solution for various application purpose.

Works with Moore to ensure high performance and reliability. Selection Selection. Selection

PSK Holdings has a variety of core technologies and product application, including semiconductor packaging equipment process technologies as well as source and hardware technologies. Descum World's best descum & surface treatment solution in semiconductor packaging industry