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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins that can be put on a dual in-line or flat package .

Many Freescale high performance products require the performance advantages of a flip chip Ball Grid Array (BGA) package. Flip chip packages are offered in bare die, flat lid and full lid configurations. Package BGA pads are soldermask defined. "Pkg SM Diam" is the BGA pad soldermask opening.

Texas Instruments’ advanced design and simulation capabilities enable package optimizations needed for maximum electrical and thermal performance. The PBGA package is offered in a range of sizes from 17mm x 17mm to 35mm x 35mm, in ball pitch of 0.8mm and 1.0mm, to provide a ball count ranging from 208 to 976 balls.

A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other cooling mechanism.

1.晶片資料(Chip Data)： (1) 晶片尺寸：依此訂出基板上晶片 墊(Die Bond Pad)的尺寸。 (2) 腳位排定：有了晶片的腳位排定 之後才能得知打線墊的腳位排定，也才 能依此決定BGA的腳位排定。 (3) 第一打線點的座標(1st Bond Coordinate)：即晶片上銲墊準確的座標

‌PBGA封装（Plastic Ball Grid Array Package）是一种常见的BGA封装形式，它采用BT树脂/玻璃层压板作为基板，以塑料环氧模塑混合物作为密封材料，焊球为共晶焊料63Sn37Pb或准共晶焊料62Sn36Pb2Ag，已有部分制造商使用无铅焊料 ，焊球和封装体的连接不需要另外使用焊料。 PBGA塑料焊球阵列封装. 有一些PBGA封装为腔体结构，分为腔体朝上和腔体朝下两种。 这种带腔体的PBGA是为了增强其散热性能，称之为热增强型 BGA，简称EBGA，有的也称之 …

Plastic Ball Grid Array (PBGA) package incorporate the most advanced assembly processes and designs for cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors.

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