DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT.
DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE.
24-Lead Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE.
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN] © 2017 Microchip Technology Incorporated For the most current package drawings, please see the Microchip Packaging Specification located at
【标准化封装 QFN系列 】 VQFN [A] - CSDN博客
2024年3月28日 · QFN（Quad Flat No-leads Package）是一种无引脚封装，呈正方形或矩形，封装底部中央位置有一个大面积裸露焊盘用来导热，围绕大焊盘的封装外围四周有实现电气连结的导电焊...
QFN系列元器件封装尺寸图资源库 - CSDN博客
2024年10月29日 · 本资源“AD可用QFN全系列封装lib”聚焦于Analog Devices（AD）公司产品中QFN封装的库文件，适用于AD10设计软件。QFN（Quad Flat No-Lead）封装是一种无引脚、四边扁平封装，因其小巧、轻薄和散热性能好而被广泛应用...
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嘉立创eda提供的qfn32 4x4引脚图，pcb封装图以及库存价格等信息
24L_QFN_4x4mm_K6.fm Author: C12761 Created Date: 20020510114735Z ...
The ZSSC3018 Sensor Signal Conditioner ICs is available in a RoHS-compliant QFN24 package (4mm x 4mm). This document provides details for package dimensions, pin assignments and layout, footprint, landing pattern, board connections, package marking, and thermal resistance. YY = Year (e.g., 15 for 2015, 16 for 2016, ...); WW = Workweek (e.g., 15)