Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology , one of several package technologies that connect ICs to the ...

QFN is a lead frame-based package which is also called CSP (Chip Scale Package) with the ability to view and contact leads after assembly. QFN packages typically use a copper lead frame for the die assembly and PCB interconnection.

qfp（ 四扁平封装 ）和qfn（ 四扁平无引线 ）也是具有挑战性的ic封装类型，但它们通常被认为比bga的难度低。这是因为它们与pcb的连接较少且较大，这使得ic和pcb之间的信号路由不那么具有挑战性。

Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold several advantages over traditional SOIC, SSOP, TSSOP, and TVSOP packages.

1 天前 · QFN lets you pack one or multiple chips together depending on what your product needs require. A single-chip design keeps its operations easy because it works with one integrated circuit. Multiple chips can be combined in one package to boost its overall capabilities. Your selection depends on the number of components in your product.

2021年4月28日 · QFN is an acronym for quad flat no-lead package. It is a leadless package that comes in small size and offers moderate heat dissipation in PCBs. Like any other IC package, the function of a QFN package is to connect the silicon die of the IC to the circuit board.

2015年7月14日 · QFN and DFN packages are plastic encapsulated lead-frame-based packages, which are near Chip Scale Package (CSP) with a low profile (< 1.0 mm). This pack-age type uses perimeter lands/pins on the bottom of the package to provide electrical contacts to the PCB. Perimeter pins can be arranged in dual-in-line (DFN) or quad (QFN) configuration.

2021年8月9日 · qfn封装是一种极具适用能力强、结构简单、高性价比的封装形式，在可预见的5年内出现替代封装的可能性不高。qfn封装的开发方向目前明朗的有两个：大尺寸、模组化。

2023年11月19日 · QFN is a leadless package that has a rectangular structure. Like the chip-level package, it is done with the use of a cutting machine. A larger area exists for the exposed pad at the lower side for heat dissipation. It comes with a conductive pad for electrical connection on the surface with a larger pad.

2024年12月4日 · What is a QFN Package and What Does It Stand For? A type of IC package is a QFN package, or Quad Flat No lead package. It is small and lead free designed. Instead of pins, it has got flat contacts around its edges. This keeps things compact, and easy for mounting on a PCB. An exposed pad is underneath the package.