Cu-clips have lower resistance and inductance than multiple wire bonds interconnected high performance MOSFETs, and Improves thermal performance. The Cu-Clip QFN package targets power management products, such as DCDC converters and motor drivers.

2016年12月1日 · Efficient power management is crucial for increasing demands on high definition mobile video streaming, 4G network communication and longer battery life, etc. UTAC developed Copper Clip QFN package for high performance MOSFETs, replacing multiple Copper or Aluminum wires with lower electrical impedance (low RDS(on)), better thermal performance a...

By April 2018, UTAC has expanded copper clip based power QFN offerings to include additional side by side and stacked MOSFET configurations, now offering various body sizes (3.5 x 4.5mm, 4 x 4mm, 5 x 5mm, 6 x 5mm and 6 x 6mm).

2023年10月24日 · 目前 Cu Clip 有两种键合方式： 1、全铜片键合方式 Gate pad 和 Source pad均是Clip方式，此键合方法成本较高，工艺较复杂，能获得更好的Rdson以及更好的热效应。 2、铜片加线键合方式

2024年12月2日 · The clip bonding approach enables a large connection area at the die, compared to conventional bond wires. The Quad Flat No‑Lead (QFN) packages are widely used due to their smaller footprints and ability to accommodate larger die within the package.

QFN Cu Clip Copper Clip is a favorable replacement for traditional wire bond interconnection used for high performance MOSFETs. UTAC is in volume production for a variety of Cu Clip packages in support of leading IDM’s in the market.

Power QFN with Cu-clip Source down structure for High Voltage Drain (High Voltage) Source-Gate (Low Voltage) Problem: Before measures Cu-clip MOSFET Lea kage Lead frame After measures Form a groove in the Lead frame Leakage becomes a …

Cuクリップは、複数のワイヤボンドを相互接続した高性能MOSFETに比べて、抵抗やインダクタンスが低くかつ放熱性を向上させます。 Cuクリップを用いたQFNパッケージは、DCDCコンバータやモータドライバなどのパワーマネジメント製品を対象としており、高電力密度、高周波スイッチング用デバイスとして期待されています。 © 2021 AOI ELECTRONICS CO.,LTD. アオイ電子は高性能QFNパッケージを提供します。 小型で優れた電気特性と価格優位性を提供し …

Clip Bond 即条带键合，是采用一个焊接到焊料的固体铜桥实现芯片和引脚连接的封装工艺。 与传统的键合封装方式相比， Cu Clip 技术有以下几点优势 ： 1、芯片与管脚的连接采用铜片，一定程度上取代芯片和引脚间的标准引线键合方式，因而可以获得独特的封装 ...

Multichip Integrated Copper Clip Package Technology, Supports High Current DC-DC Converter Applications Michael-HyungMa9k-Cho', kyuw Ko [win and Smith; WAC Group