The Texas Instruments (TI) 56-pin QFN package, designated RGQ, is a JEDEC standard MO-220-compliant leadless package that has several advantages over traditional SOIC, TQFP, …

QFN封装不同于具有欧翼状引脚的传统DIP或SOP封装，QFN封装经过表面贴装后管脚与PCB焊盘之间的导电路径短，自感系数和封装体内的布线电阻很低，所以它也可以提供良好的电性能。 …

Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and …

Find the Quad Flat No Lead (QFN) package drawing and specifications such as pin count, pitch and dimension.

QFN is a lead frame-based package which is also called CSP (Chip Scale Package) with the ability to view and contact leads after assembly. QFN packages typically use a copper lead …

QFN（Quad Flat No-leads Package，方形扁平无引脚封装），表面贴装型封装之一。 值得注意的是，QFN封装与LCC封装完全不同，LCC仍有外延引脚，只是将引脚弯折至底部，而QFN封 …

2012年12月13日 · QFN是一种无引脚封装，呈正方形或矩形，封装底部中央位置有一个大面积裸露焊盘用来导热，围绕大焊盘的封装四周有实现电气连接的导电焊盘。 由于 QFN封装不像传统 …

QFN封装. QFN（ Quad Flat No-lead ）封装是一种四面平无引脚的封装方式，集成电路被封装在塑料芯片内，四面开有电子连接端，其主要特点是没有引脚。 特点： - 小尺寸，低高度，适用 …

2015年7月14日 · QFN and DFN packages are plastic encapsulated lead-frame-based packages, which are near Chip Scale Package (CSP) with a low profile (<1.0 mm). This pack-age type …

Quad Flat No-Lead (QFN) and Dual Flat No-Lead (DFN) package offering includes QFNs, QFNp, VQFN, WQFN, UQFN, XQFN, QFNp-dr and QFNs-mr. We offer multiple QFN configurations …