Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold several advantages over traditional SOIC, SSOP, TSSOP, and TVSOP packages.

The purpose of this document is to provide a pinout standard for 1-, 2- and 3-bit logic devices offered in 6- or 8-land SON/QFN packages for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

The purpose of this document is to provide a pinout standard for 1-, 2- and 3-bit logic devices offered in 5-, 6- or 8-land SON/QFN packages for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

The QFN 14-/16-/20-pin RGY* packages and 24-pin RHL package have the same pinout as the thin scale small outline packages (TSSOP); however, it is up to 62% smaller than the TSSOP. According to QFN modeling data, thermal performance is improved from 60–70% and inductance improved up to 60% over the TSSOP.

AN72845 offers guidelines for the design, manufacturing, and handling of Infineon quad flat no-lead (QFN) packages on printed circuit boards (PCBs) and flexible printed circuits (FPC).

The purpose of this document is to provide a pinout standard for 1-, 2- and 3-bit logic devices offered in 5-, 6- or 8-land SON/QFN packages for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

QFN benefits include a decreasing lead inductance due to optimally short bond wires, light weight, thin profile and small sized “near chip scale” footprint. The QFN package is perfect for many new applications that need better performance in size, weight, thermal and electrical properties.

The Texas Instruments (TI) 56-pin QFN package, designated RGQ, is a JEDEC standard MO-220-compliant leadless package that has several advantages over traditional SOIC, TQFP, TSSOP, and TVSOP packaging. The RGQ package physically is smaller than traditional leaded

2024年6月4日 · The main difference would be the package it comes in, so either 48 or 73 pin option for QFN. You can read all about the pins of each package type here: https://docs.nordicsemi.com/bundle/ps_nrf52840/page/pin.html

Note: The center pad underneath the QFN packages can be connected to PCB ground or left electrically unconnected. Solder or glue it to the board to ensure good mechanical stability.