Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold several advantages over traditional SOIC, SSOP, TSSOP, and TVSOP packages.

QFN is a lead frame-based package which is also called CSP (Chip Scale Package) with the ability to view and contact leads after assembly. QFN packages typically use a copper lead frame for the die assembly and PCB interconnection. The QFN package can …

Find the Quad Flat No Lead (QFN) package drawing and specifications such as pin count, pitch and dimension.

2002年4月26日 · Q: How does QFN pin-out compare to TSSOP, SOIC or SSOP? A: The new QFN package offerings from Texas Instruments allow for a conventional pin-out scheme similar to traditional dual in-line packages. Function to pin number assignments in QFN are assigned the same pin number as in TSSOP and other dual in-line packages

2024年11月28日 · QFN 封装通常包含两个重要部分：引脚（Pins）和接地焊盘（GND Pads）。 QFN 封装的引脚通常不直接从封装外伸出，而是位于封装的底部，沿着封装的边缘布置。 QFN 的接地焊盘位于芯片的底部，并且通常是一个较大的金属区域，具有多个连接到 PCB 的接地焊盘。 这些接地焊盘有助于提供电气和热管理功能。 引脚焊盘： QFN 封装的引脚通常为矩形或者带有特殊形状的焊盘，通常用于连接信号、VDD、电源、控制和数据线等。 这些焊盘需要根据芯片 …

2023年11月19日 · What is the name of the QFN package? QFN’s full form is quad flat no-lead package. The main parts of QFN packages are the lead frame, single or many dies, wire bonds, and molding compounds.

Successful implementation of QFN-style packages, including QFNs and DQFNs, requires special consideration for PCB Footprint design, PCB layout, and solder paste stencil design. This application note describes these important consid-erations. The following guidelines are based on Microchip’s experience and knowledge, and may be accepted or rejected.

1 天前 · QFN packages exist in several design options to support different types of applications. The different QFN package types are Wire Bond, Flip-chip, Punched, Sawn, Air-Cavity, and Plastic Molded. ... The package’s decreased number of pins makes both system operation and signal integrity better. Through their pad exposure, these packages enable ...

2015年7月14日 · QFN and DFN packages are plastic encapsulated lead-frame-based packages, which are near Chip Scale Package (CSP) with a low profile (<1.0 mm). This pack-age type uses perimeter lands/pins on the bottom of the package to provide electrical contacts to the PCB. Perimeter pins can be arranged in dual-in-line (DFN) or quad (QFN) configuration.

Dual-row and three-row QFN packages are designed to provide superior thermal performance. While a thermal pad provides a solderable surface on the top of the PCB (for soldering the package die paddle on the board), thermal vias are needed to provide a thermal path to inner and bottom layers of the PCB to remove the heat.