Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.

QFN是一种无引脚封装，呈正方形或矩形，封装底部中央位置有一个大面积裸露 焊盘 用来导热，围绕大焊盘的封装外围四周有实现电气连结的导电焊盘。 由于QFN封装不像传统的SOIC与 TSOP封装 那样具有鸥翼状引线，内部引脚与焊盘之间的导电路径短， 自感系数 以及封装体内布线电阻很低。 此外，它还通过外露的 引线框架 焊盘提供了出色的 散热性能，该焊盘具有直接散热通道，用于释放封装内的热量。 通常将散热焊盘直接焊接在电路板上，并且 PCB 中的散热过 …

First, the original chip is removed by pre-heating the board and applying hot air using the same methods that will be detailed below. The pads on the removed chip and board are then cleaned by adding flux and using solder wick.

Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold several advantages over traditional SOIC, SSOP, TSSOP, and TVSOP packages.

The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB and provides a stable ground through down bonds or by electrical connections through conductive die attach material.

2020年12月22日 · QFN (quad flat no-lead) package is an IC component best used for programmable modules and microcomputers. It is also recommended to use this package for PCB designs with size, thickness and weight considerations. It is also known as quad micro leadframe package. Using QFN Packages. Pros:

QFN is a lead frame-based package which is also called CSP (Chip Scale Package) with the ability to view and contact leads after assembly. QFN packages typically use a copper lead frame for the die assembly and PCB interconnection. The QFN package can …

2023年11月19日 · QFN is a leadless package that has a rectangular structure. Like the chip-level package, it is done with the use of a cutting machine. A larger area exists for the exposed pad at the lower side for heat dissipation. It comes with a conductive pad for electrical connection on the surface with a larger pad.

2021年4月28日 · QFN is an acronym for quad flat no-lead package. It is a leadless package that comes in small size and offers moderate heat dissipation in PCBs. Like any other IC package, the function of a QFN package is to connect the silicon die of the IC to the circuit board. What’s inside a QFN package?

2023年3月20日 · Quad-flat-no-lead (QFN) packages are popular in circuits due to their small size, light weight, and thin profile. A larger portion of the QFN package gets soldered to the PCB and enhances the mechanical strength. QFN packages are otherwise known as chip-scale packages, as the lead can be contacted and seen even after assembly.