品名：无铅sac305锡球 1.适用 此产品为ic 封装与主板植球制程专用之无铅bga 锡球。 2. 产品规格 （1）型号：icm-sac305-bga005~180 （2）合金成分：sn96.5/ag3.0/cu0.5 （3）尺寸：直 …

SAC305 Electropure is a high purity lead-free alloy containing 96.5% tin, 3% silver, and 0.5% copper. In solid solders, AIM’s Electropure proprietary manufacturing method reduces …

SAC305 alloy is a lead-free alloy suitable for use as a replacement for the Sn63Pb37 alloy. The replenishment alloys are sometimes used to stabilize and reduce the copper content in the

SAC305 系列无铅免清洗高可靠性锡膏，是为适应环保要求而研发的， 作为一款绿色产品，它满足欧盟的RoHS 及REACH 要求，同时其工艺 应用范围广泛。 特点. ① 助焊膏体系为无铅焊 …

【用途】 云南锡业股份有限公司无铅焊料SAC3005适用于电子行业软钎焊、散热器及五金等各行业波峰焊、浸焊等精密焊接、特殊焊接工艺以及喷涂、镀锡等。 还可根据客户需求提供其他 …

SAC305 lead-free alloy contains 96.5 % tin, 3% silver, and 0.5% copper and is RoHS, REACH and JEIDA compliant. Applications include Wave, Selective, Hand and SMT Reflow Soldering. …

SAC305, SAC387 and SAC405 are suitable for lead free wave soldering andselective soldering. A solder pot temperature of 255 to 265 °C (491 to 509 °F) is recommended for wave soldering …

SAC305 is a widely used lead-free solder alloy made of tin (Sn), silver (Ag), and copper (Cu), with the composition of 96.5% tin, 3.0% silver, and 0.5% copper. The alloy was developed to …

SAC305 Electropure 是一种高纯度无铅合金，含有 96.5% 锡、3% 银和 0.5% 铜。在固体焊料中，AIM 的 Electropure 特殊的制造方法减少了氧化物，形成了一种锡渣少、润湿强的合金。

Alpha SAC305 Lead-Free Bar Solder offers a reliable, RoHS-compliant solution for electronics and electrical soldering. This solder is ideal for high-reliability applications such as circuit …