SAC305 is suitable for lead-free wave and selective soldering. A solder pot temperature of 255 to 265 °C (491 to 509 °F) is recommended for wave soldering application.

SAC305 Electropure is a high purity lead-free alloy containing 96.5% tin, 3% silver, and 0.5% copper. In solid solders, AIM’s Electropure proprietary manufacturing method reduces suspended oxides creating a low drossing, strong wetting alloy. SAC305 is widely used in hand, selective, wave and SMT soldering.

High Silver Alloy for Wave and Selective Soldering . DESCRIPTION . SAC305, SAC387 and SAC405 and their replenishment alloys SAC300, SAC350, SAC380 and SAC400 are lead-free alloys suitable for use as a replacement for Sn63Pb37alloy.

CONTACT AIM TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE. THE REFLOW PROFILE FOR THE SAC305 PASTES USING A VAPOR PHASE REFLOW OVEN: PEAK TEMPERATURE RANGE I S 230°C – 245°C. WS483 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse.

5 is a lead-free solder alloy composed of 96.5% tin, 3% silver, and 0.5% copper. It is widely used in. various soldering applications as a replacement for traditional tin-lead alloys. SAC 305 offers excellent wetting . AC 305 solder alloy demonstrates good compatibility with most common flux types. It readily interacts with fluxe.

dovetail connector series sac305 reflow solder profile 0 50 100 150 200 250 300 0 75 135 210 270 315 temperature (° c) time (sec) sparsely populated boards 0 50 100

SAC305 lead-free alloy contains 96.5 % tin, 3% silver, and 0.5% copper and is RoHS, REACH and JEIDA compliant. Applications include Wave, Selective, Hand and SMT Reflow Soldering. AIM ElectropureTM SAC305 bar solder offers reduced dross production and superior wetting and fluidity as compared to other solder brands.

SAC305、SAC387 和SAC405 适用于无铅波峰焊以及选择性焊接。 对于波峰焊应用,推荐焊料槽温度为255 – 265°C (491 – 509°F)。 如果用于选择性焊接,建议将焊槽温度设为280 至320°C(536 至608°F)。 可以考虑使用N2 环境(<1000ppm O2)进一步减少氧化。 相关的波峰焊接助焊剂,请参考我们的选择指南。 可提供无铅焊料回收服务,包括专门的无铅容器,请咨询当地的分公司。 符合所有RoHS 指令要求((欧洲指令 2011/65/EU,4.1 条) 。 合金规范最大铅(Pb) 含量=0.07%。 SAC 合 …

Reflow profile of SAC305 applicable. The melting point of S1XBIG is 211-223oC. By adding KOKI’s newly developed flux into the mix, the temperature profile of SAC305 has become applicable to S1XBIG. S1XBIG is flexible solder paste which is low in Ag yet has workability as high as conventional products.

SAC305 (96.5% Sn, 3.0% Ag, and 0.5% Cu) has emerged as the go-to lead-free alloy by popular choice. SAC305 has proven itself a worthy replacement for Sn63, although requirements in the automotive, aerospace, and military industries have driven further research for alloys with even higher reliability expectations.