Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology , one of several package technologies that connect ICs to the ...

QFN/DFN (Quad Flat No-Lead/Dual Flat No-Lead)是使用傳統導線架 (Lead frame)且接 近晶片尺寸封裝件 (CSP ,Chip Size Package)之一種先進的塑膠封裝件。 如 Fig.1 & Fig.2 所示。 此種裝件係直接將引腳 (Lead)外露於封裝件之膠體下面,不似傳統封裝件,如 QFP (Quad Flat Package)之引腳從膠體外側延伸,從而減少 PCB 面積的佔用,因而有輕、薄、短、小 的特徵。 如 Fig.3 & Fig.4 所示,係 QFN/DFN 產品與相對應傳統產品的尺寸比較。

2024年1月5日 · Surface-mount Device (SMD) There are a variety of surface-mount packages including SOP, small-outline transistor (SOT), and QFP available in the market. SMD IC packages usually need custom PCBs, containing a matching pattern of …

Various onsemi components are packaged in an advanced Dual or Quad Flat−Pack No−Lead package (DFN/QFN). The DFN/QFN platform represents the latest in surface mount packaging technology. It is important to follow the suggested board mounting guidelines outlined in …

2024年1月28日 · dfn封装是一种先进的电子元件封装工艺，与smd封装相比，dfn封装提供了更高的灵活性和稳定性。 DFN封装，全称为Dual Flat No-le ad Package，是一种最新的表面贴装封装技术。

2015年7月14日 · QFN and DFN packages are plastic encapsulated lead-frame-based packages, which are near Chip Scale Package (CSP) with a low profile (< 1.0 mm). This pack-age type uses perimeter lands/pins on the bottom of the package to provide electrical contacts to the PCB. Perimeter pins can be arranged in dual-in-line (DFN) or quad (QFN) configuration.

为解决单一芯片集成度低和功能不够完善的问题，把多个高集成度、高性能、高可靠性的芯片，在高密度多层互联基板上用SMD技术组成多种多样的电子模块系统，从而出现MCM(Multi Chip Module)多芯片模块系统。

As already mentioned in the introduction, leadless DFN packages are becoming ever more important to realize growing electronic functionality in compact devices. This section will focus on the driving factors for evolution of packages from leaded SMD to leadless DFN packages and on the advantages of DFN packages.

The DFN package with side-wettable flank technology conserves board space and provides excellent visibility of solder joints for Automated Visual Inspection (AVI), enhancing reliability and yield. Additionally, the DFN package with flip-chip technology also offers superior heat management capabilities and heightened power density.

2023年12月12日 · 与传统的表面贴装封装（SMD）相比，DFN封装的主要特点是缺少外部焊盘引脚，而是在器件底部布置焊盘，使得封装更加紧凑。 DFN封装通常采用先进的半导体工艺制造，通过精密的制造工艺，将芯片封装在薄而坚固的塑料或陶瓷基底中，并使用微弧焊或其他高精度的连接技术，将芯片与焊盘连接，从而实现电气和机械连接。 1. 尺寸小巧： DFN封装采用紧凑的设计，使得器件尺寸更小，适用于高度微型化的电子设备。 2. 良好的散热性能： 由于DFN封装的 …